JPS5427714B2 - - Google Patents
Info
- Publication number
- JPS5427714B2 JPS5427714B2 JP3248172A JP3248172A JPS5427714B2 JP S5427714 B2 JPS5427714 B2 JP S5427714B2 JP 3248172 A JP3248172 A JP 3248172A JP 3248172 A JP3248172 A JP 3248172A JP S5427714 B2 JPS5427714 B2 JP S5427714B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248172A JPS5427714B2 (enFirst) | 1972-03-31 | 1972-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248172A JPS5427714B2 (enFirst) | 1972-03-31 | 1972-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS48101085A JPS48101085A (enFirst) | 1973-12-20 |
| JPS5427714B2 true JPS5427714B2 (enFirst) | 1979-09-11 |
Family
ID=12360164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3248172A Expired JPS5427714B2 (enFirst) | 1972-03-31 | 1972-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5427714B2 (enFirst) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717178A (en) * | 1980-07-07 | 1982-01-28 | Nec Corp | Field-effect transistor |
| JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
| JPS5778158A (en) * | 1980-11-04 | 1982-05-15 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit device |
| JPS5853838A (ja) * | 1981-09-26 | 1983-03-30 | Mitsubishi Electric Corp | 半導体装置 |
| JPS59163843A (ja) * | 1983-03-09 | 1984-09-14 | Nippon Denso Co Ltd | 半導体装置 |
-
1972
- 1972-03-31 JP JP3248172A patent/JPS5427714B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS48101085A (enFirst) | 1973-12-20 |