JPS5427714B2 - - Google Patents

Info

Publication number
JPS5427714B2
JPS5427714B2 JP3248172A JP3248172A JPS5427714B2 JP S5427714 B2 JPS5427714 B2 JP S5427714B2 JP 3248172 A JP3248172 A JP 3248172A JP 3248172 A JP3248172 A JP 3248172A JP S5427714 B2 JPS5427714 B2 JP S5427714B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3248172A
Other languages
Japanese (ja)
Other versions
JPS48101085A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3248172A priority Critical patent/JPS5427714B2/ja
Publication of JPS48101085A publication Critical patent/JPS48101085A/ja
Publication of JPS5427714B2 publication Critical patent/JPS5427714B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3248172A 1972-03-31 1972-03-31 Expired JPS5427714B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3248172A JPS5427714B2 (enrdf_load_stackoverflow) 1972-03-31 1972-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3248172A JPS5427714B2 (enrdf_load_stackoverflow) 1972-03-31 1972-03-31

Publications (2)

Publication Number Publication Date
JPS48101085A JPS48101085A (enrdf_load_stackoverflow) 1973-12-20
JPS5427714B2 true JPS5427714B2 (enrdf_load_stackoverflow) 1979-09-11

Family

ID=12360164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3248172A Expired JPS5427714B2 (enrdf_load_stackoverflow) 1972-03-31 1972-03-31

Country Status (1)

Country Link
JP (1) JPS5427714B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717178A (en) * 1980-07-07 1982-01-28 Nec Corp Field-effect transistor
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
JPS5778158A (en) * 1980-11-04 1982-05-15 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit device
JPS5853838A (ja) * 1981-09-26 1983-03-30 Mitsubishi Electric Corp 半導体装置
JPS59163843A (ja) * 1983-03-09 1984-09-14 Nippon Denso Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS48101085A (enrdf_load_stackoverflow) 1973-12-20

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