JPS5424823B2 - - Google Patents

Info

Publication number
JPS5424823B2
JPS5424823B2 JP4502275A JP4502275A JPS5424823B2 JP S5424823 B2 JPS5424823 B2 JP S5424823B2 JP 4502275 A JP4502275 A JP 4502275A JP 4502275 A JP4502275 A JP 4502275A JP S5424823 B2 JPS5424823 B2 JP S5424823B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4502275A
Other languages
Japanese (ja)
Other versions
JPS51120176A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50045022A priority Critical patent/JPS51120176A/ja
Publication of JPS51120176A publication Critical patent/JPS51120176A/ja
Publication of JPS5424823B2 publication Critical patent/JPS5424823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP50045022A 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts Granted JPS51120176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50045022A JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50045022A JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Publications (2)

Publication Number Publication Date
JPS51120176A JPS51120176A (en) 1976-10-21
JPS5424823B2 true JPS5424823B2 (xx) 1979-08-23

Family

ID=12707700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50045022A Granted JPS51120176A (en) 1975-04-14 1975-04-14 Method of evaluating bonding characteristic of metal surfaces of micro electric parts

Country Status (1)

Country Link
JP (1) JPS51120176A (xx)

Also Published As

Publication number Publication date
JPS51120176A (en) 1976-10-21

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