JPS5424820B2 - - Google Patents

Info

Publication number
JPS5424820B2
JPS5424820B2 JP11675A JP11675A JPS5424820B2 JP S5424820 B2 JPS5424820 B2 JP S5424820B2 JP 11675 A JP11675 A JP 11675A JP 11675 A JP11675 A JP 11675A JP S5424820 B2 JPS5424820 B2 JP S5424820B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11675A
Other languages
Japanese (ja)
Other versions
JPS5179567A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11675A priority Critical patent/JPS5424820B2/ja
Publication of JPS5179567A publication Critical patent/JPS5179567A/ja
Publication of JPS5424820B2 publication Critical patent/JPS5424820B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP11675A 1975-01-06 1975-01-06 Expired JPS5424820B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11675A JPS5424820B2 (enrdf_load_stackoverflow) 1975-01-06 1975-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11675A JPS5424820B2 (enrdf_load_stackoverflow) 1975-01-06 1975-01-06

Publications (2)

Publication Number Publication Date
JPS5179567A JPS5179567A (enrdf_load_stackoverflow) 1976-07-10
JPS5424820B2 true JPS5424820B2 (enrdf_load_stackoverflow) 1979-08-23

Family

ID=11465071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11675A Expired JPS5424820B2 (enrdf_load_stackoverflow) 1975-01-06 1975-01-06

Country Status (1)

Country Link
JP (1) JPS5424820B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit

Also Published As

Publication number Publication date
JPS5179567A (enrdf_load_stackoverflow) 1976-07-10

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