JPS5423794B2 - - Google Patents
Info
- Publication number
- JPS5423794B2 JPS5423794B2 JP1052575A JP1052575A JPS5423794B2 JP S5423794 B2 JPS5423794 B2 JP S5423794B2 JP 1052575 A JP1052575 A JP 1052575A JP 1052575 A JP1052575 A JP 1052575A JP S5423794 B2 JPS5423794 B2 JP S5423794B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
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- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H01L2924/01047—Silver [Ag]
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- H01L2924/207—Diameter ranges
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20756—Diameter ranges larger or equal to 60 microns less than 70 microns
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20757—Diameter ranges larger or equal to 70 microns less than 80 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1052575A JPS5423794B2 (US20090163788A1-20090625-C00002.png) | 1975-01-27 | 1975-01-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1052575A JPS5423794B2 (US20090163788A1-20090625-C00002.png) | 1975-01-27 | 1975-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5185669A JPS5185669A (US20090163788A1-20090625-C00002.png) | 1976-07-27 |
JPS5423794B2 true JPS5423794B2 (US20090163788A1-20090625-C00002.png) | 1979-08-16 |
Family
ID=11752652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1052575A Expired JPS5423794B2 (US20090163788A1-20090625-C00002.png) | 1975-01-27 | 1975-01-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5423794B2 (US20090163788A1-20090625-C00002.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4722671B2 (ja) * | 2005-10-28 | 2011-07-13 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
CN105810652A (zh) * | 2015-01-19 | 2016-07-27 | Mk电子株式会社 | 接合线 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5614650U (US20090163788A1-20090625-C00002.png) * | 1979-07-14 | 1981-02-07 | ||
JPS56169341A (en) * | 1980-05-31 | 1981-12-26 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor element |
US6711925B2 (en) * | 2001-12-17 | 2004-03-30 | Asep Tec Co., Ltd. | Process for manufacturing a conductive wire suitable for use in semiconductor packages |
JP5728126B2 (ja) * | 2012-02-27 | 2015-06-03 | 日鉄住金マイクロメタル株式会社 | パワー半導体装置及びその製造方法並びにボンディングワイヤ |
KR101668975B1 (ko) | 2014-01-31 | 2016-10-24 | 다츠다 덴센 가부시키가이샤 | 와이어 본딩 및 그 제조 방법 |
-
1975
- 1975-01-27 JP JP1052575A patent/JPS5423794B2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4722671B2 (ja) * | 2005-10-28 | 2011-07-13 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
CN105810652A (zh) * | 2015-01-19 | 2016-07-27 | Mk电子株式会社 | 接合线 |
Also Published As
Publication number | Publication date |
---|---|
JPS5185669A (US20090163788A1-20090625-C00002.png) | 1976-07-27 |