JPS5423564U - - Google Patents
Info
- Publication number
- JPS5423564U JPS5423564U JP1977095962U JP9596277U JPS5423564U JP S5423564 U JPS5423564 U JP S5423564U JP 1977095962 U JP1977095962 U JP 1977095962U JP 9596277 U JP9596277 U JP 9596277U JP S5423564 U JPS5423564 U JP S5423564U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977095962U JPS5744687Y2 (cg-RX-API-DMAC7.html) | 1977-07-18 | 1977-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977095962U JPS5744687Y2 (cg-RX-API-DMAC7.html) | 1977-07-18 | 1977-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5423564U true JPS5423564U (cg-RX-API-DMAC7.html) | 1979-02-16 |
| JPS5744687Y2 JPS5744687Y2 (cg-RX-API-DMAC7.html) | 1982-10-02 |
Family
ID=29029402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977095962U Expired JPS5744687Y2 (cg-RX-API-DMAC7.html) | 1977-07-18 | 1977-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5744687Y2 (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166994U (cg-RX-API-DMAC7.html) * | 1980-05-12 | 1980-12-01 | ||
| JPS55166993U (cg-RX-API-DMAC7.html) * | 1980-05-12 | 1980-12-01 | ||
| JPS5726448A (en) * | 1980-07-23 | 1982-02-12 | Hitachi Ltd | Pellet attaching device with recognizing mechanism |
-
1977
- 1977-07-18 JP JP1977095962U patent/JPS5744687Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166994U (cg-RX-API-DMAC7.html) * | 1980-05-12 | 1980-12-01 | ||
| JPS55166993U (cg-RX-API-DMAC7.html) * | 1980-05-12 | 1980-12-01 | ||
| JPS5726448A (en) * | 1980-07-23 | 1982-02-12 | Hitachi Ltd | Pellet attaching device with recognizing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5744687Y2 (cg-RX-API-DMAC7.html) | 1982-10-02 |