JPS5423563U - - Google Patents

Info

Publication number
JPS5423563U
JPS5423563U JP1977096121U JP9612177U JPS5423563U JP S5423563 U JPS5423563 U JP S5423563U JP 1977096121 U JP1977096121 U JP 1977096121U JP 9612177 U JP9612177 U JP 9612177U JP S5423563 U JPS5423563 U JP S5423563U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977096121U
Other languages
Japanese (ja)
Other versions
JPS5826525Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977096121U priority Critical patent/JPS5826525Y2/ja
Publication of JPS5423563U publication Critical patent/JPS5423563U/ja
Application granted granted Critical
Publication of JPS5826525Y2 publication Critical patent/JPS5826525Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1977096121U 1977-07-18 1977-07-18 半導体装置 Expired JPS5826525Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977096121U JPS5826525Y2 (ja) 1977-07-18 1977-07-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977096121U JPS5826525Y2 (ja) 1977-07-18 1977-07-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS5423563U true JPS5423563U (enrdf_load_stackoverflow) 1979-02-16
JPS5826525Y2 JPS5826525Y2 (ja) 1983-06-08

Family

ID=29029706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977096121U Expired JPS5826525Y2 (ja) 1977-07-18 1977-07-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS5826525Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956865U (enrdf_load_stackoverflow) * 1972-08-25 1974-05-20
JPS50156874A (enrdf_load_stackoverflow) * 1974-06-06 1975-12-18
JPS5150661A (enrdf_load_stackoverflow) * 1974-10-30 1976-05-04 Hitachi Ltd

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956865U (enrdf_load_stackoverflow) * 1972-08-25 1974-05-20
JPS50156874A (enrdf_load_stackoverflow) * 1974-06-06 1975-12-18
JPS5150661A (enrdf_load_stackoverflow) * 1974-10-30 1976-05-04 Hitachi Ltd

Also Published As

Publication number Publication date
JPS5826525Y2 (ja) 1983-06-08

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