JPS5423014B1 - - Google Patents
Info
- Publication number
- JPS5423014B1 JPS5423014B1 JP4132871A JP4132871A JPS5423014B1 JP S5423014 B1 JPS5423014 B1 JP S5423014B1 JP 4132871 A JP4132871 A JP 4132871A JP 4132871 A JP4132871 A JP 4132871A JP S5423014 B1 JPS5423014 B1 JP S5423014B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4132871A JPS5423014B1 (ja) | 1971-06-10 | 1971-06-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4132871A JPS5423014B1 (ja) | 1971-06-10 | 1971-06-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5423014B1 true JPS5423014B1 (ja) | 1979-08-10 |
Family
ID=12605435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4132871A Pending JPS5423014B1 (ja) | 1971-06-10 | 1971-06-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5423014B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102985463A (zh) * | 2010-07-30 | 2013-03-20 | 日立化成工业株式会社 | 多元羧酸缩合物、热固化性树脂组合物、光半导体元件搭载用基板及其制造方法、以及光半导体装置 |
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1971
- 1971-06-10 JP JP4132871A patent/JPS5423014B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102985463A (zh) * | 2010-07-30 | 2013-03-20 | 日立化成工业株式会社 | 多元羧酸缩合物、热固化性树脂组合物、光半导体元件搭载用基板及其制造方法、以及光半导体装置 |