JPS5421548B1 - - Google Patents

Info

Publication number
JPS5421548B1
JPS5421548B1 JP3873768A JP3873768A JPS5421548B1 JP S5421548 B1 JPS5421548 B1 JP S5421548B1 JP 3873768 A JP3873768 A JP 3873768A JP 3873768 A JP3873768 A JP 3873768A JP S5421548 B1 JPS5421548 B1 JP S5421548B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3873768A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5421548B1 publication Critical patent/JPS5421548B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48091—Arched
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/92—Specific sequence of method steps
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    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP3873768A 1967-06-07 1968-06-07 Pending JPS5421548B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64431467A 1967-06-07 1967-06-07

Publications (1)

Publication Number Publication Date
JPS5421548B1 true JPS5421548B1 (ja) 1979-07-31

Family

ID=24584375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3873768A Pending JPS5421548B1 (ja) 1967-06-07 1968-06-07

Country Status (4)

Country Link
US (1) US3497774A (ja)
JP (1) JPS5421548B1 (ja)
DE (1) DE1766528B1 (ja)
GB (1) GB1181621A (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676741A (en) * 1970-12-09 1972-07-11 Bell Telephone Labor Inc Semiconductor target structure for image converting device comprising an array of silver contacts having discontinuous nodular structure
US3779804A (en) * 1970-12-30 1973-12-18 Nat Lead Co Electrodes for ceramic bodies
US3737742A (en) * 1971-09-30 1973-06-05 Trw Inc Monolithic bi-polar semiconductor device employing cermet for both schottky barrier and ohmic contact
US3919589A (en) * 1973-04-06 1975-11-11 Rca Corp Electroluminescent cell with a current-limiting layer of high resistivity
US3943557A (en) * 1974-02-19 1976-03-09 Plessey Incorporated Semiconductor package with integral hermeticity detector
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
US4153907A (en) * 1977-05-17 1979-05-08 Vactec, Incorporated Photovoltaic cell with junction-free essentially-linear connections to its contacts
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4436785A (en) 1982-03-08 1984-03-13 Johnson Matthey Inc. Silver-filled glass
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
JPS58169942A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
DE3520945A1 (de) * 1985-06-12 1986-12-18 Anton Piller GmbH & Co KG, 3360 Osterode Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen
US4636254A (en) * 1985-07-23 1987-01-13 Quantum Materials, Inc. Silver-glass paste for attachment of silicon die to ceramic substrate
US4761224A (en) * 1986-03-10 1988-08-02 Quantum Materials Inc. Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
US4714726A (en) * 1986-06-04 1987-12-22 W. R. Grace & Co. Low temperature single step curing polyimide adhesive
US4740830A (en) * 1986-06-04 1988-04-26 W. R. Grace & Co. Low temperature single step curing polyimide adhesive
US4906596A (en) * 1987-11-25 1990-03-06 E. I. Du Pont De Nemours & Co. Die attach adhesive composition
GB8730196D0 (en) * 1987-12-24 1988-02-03 Johnson Matthey Plc Silver-filled glass
US4986849A (en) * 1988-09-23 1991-01-22 Johnson Matthey Inc. Silver-glass pastes
IT217023Z2 (it) * 1989-04-13 1991-10-29 Nikolaidi Anna Asciugacapelli elettrico
US4933030A (en) * 1989-06-21 1990-06-12 Dietz Raymond L Low temperature glass composition, paste and method of use
US5076876A (en) * 1989-06-21 1991-12-31 Diemat, Inc. Method of attaching an electronic device to a substrate
US5075262A (en) * 1990-02-21 1991-12-24 Johnson Matthey, Inc. Silver-glass pastes
US5084421A (en) * 1990-07-27 1992-01-28 Johnson Matthey, Inc. Silver-glass pastes
US6020646A (en) * 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
US6863209B2 (en) * 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
EP2459341A1 (de) * 2009-07-27 2012-06-06 Basf Se Thermoelektrische module mit verbesserter kontaktanbindung
DE102011083906A1 (de) * 2011-09-30 2013-04-04 Robert Bosch Gmbh Fügehilfe für ein Leistungsmodul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2809332A (en) * 1953-07-29 1957-10-08 Rca Corp Power semiconductor devices
NL251301A (ja) * 1959-05-06 1900-01-01
NL291352A (ja) * 1962-04-10 1900-01-01

Also Published As

Publication number Publication date
US3497774A (en) 1970-02-24
DE1766528B1 (de) 1971-12-23
GB1181621A (en) 1970-02-18

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