JPS5421168A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS5421168A
JPS5421168A JP8655977A JP8655977A JPS5421168A JP S5421168 A JPS5421168 A JP S5421168A JP 8655977 A JP8655977 A JP 8655977A JP 8655977 A JP8655977 A JP 8655977A JP S5421168 A JPS5421168 A JP S5421168A
Authority
JP
Japan
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8655977A
Other languages
English (en)
Inventor
Teruo Hidaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP8655977A priority Critical patent/JPS5421168A/ja
Publication of JPS5421168A publication Critical patent/JPS5421168A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP8655977A 1977-07-18 1977-07-18 Semiconductor Pending JPS5421168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8655977A JPS5421168A (en) 1977-07-18 1977-07-18 Semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8655977A JPS5421168A (en) 1977-07-18 1977-07-18 Semiconductor

Publications (1)

Publication Number Publication Date
JPS5421168A true JPS5421168A (en) 1979-02-17

Family

ID=13890360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8655977A Pending JPS5421168A (en) 1977-07-18 1977-07-18 Semiconductor

Country Status (1)

Country Link
JP (1) JPS5421168A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241959A (ja) * 1985-04-18 1986-10-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体モジユ−ル
JPS6281741A (ja) * 1985-10-07 1987-04-15 Nec Ic Microcomput Syst Ltd 集積回路用パツケ−ジ
JPH01205541A (ja) * 1988-02-12 1989-08-17 Hitachi Ltd 樹脂封止型半導体装置及びその製造方法
US5724726A (en) * 1992-06-05 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of making leadframe for lead-on-chip (LOC) semiconductor device
US6072228A (en) * 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241959A (ja) * 1985-04-18 1986-10-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体モジユ−ル
JPH0312781B2 (ja) * 1985-04-18 1991-02-21 Intaanashonaru Bijinesu Mashiinzu Corp
JPS6281741A (ja) * 1985-10-07 1987-04-15 Nec Ic Microcomput Syst Ltd 集積回路用パツケ−ジ
JPH01205541A (ja) * 1988-02-12 1989-08-17 Hitachi Ltd 樹脂封止型半導体装置及びその製造方法
US5724726A (en) * 1992-06-05 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of making leadframe for lead-on-chip (LOC) semiconductor device
US5763829A (en) * 1992-06-05 1998-06-09 Mitsubishi Denki Kabushiki Kaisha Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe
US6072228A (en) * 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US6140154A (en) * 1996-10-25 2000-10-31 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US6362022B1 (en) 1996-10-25 2002-03-26 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US6902952B2 (en) 1996-10-25 2005-06-07 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US6946722B2 (en) 1996-10-25 2005-09-20 Micron Technology, Inc. Multi-part lead frame with dissimilar materials
US7321160B2 (en) 1996-10-25 2008-01-22 Micron Technology, Inc. Multi-part lead frame

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