JPS542069B2 - - Google Patents
Info
- Publication number
- JPS542069B2 JPS542069B2 JP14804574A JP14804574A JPS542069B2 JP S542069 B2 JPS542069 B2 JP S542069B2 JP 14804574 A JP14804574 A JP 14804574A JP 14804574 A JP14804574 A JP 14804574A JP S542069 B2 JPS542069 B2 JP S542069B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804574A JPS542069B2 (https=) | 1974-12-25 | 1974-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804574A JPS542069B2 (https=) | 1974-12-25 | 1974-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5174575A JPS5174575A (https=) | 1976-06-28 |
| JPS542069B2 true JPS542069B2 (https=) | 1979-02-01 |
Family
ID=15443891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14804574A Expired JPS542069B2 (https=) | 1974-12-25 | 1974-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS542069B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57113239A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Ultrasonic wire bonding apparatus |
| JPS57113240A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Wire bonding apparatus |
-
1974
- 1974-12-25 JP JP14804574A patent/JPS542069B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5174575A (https=) | 1976-06-28 |