JPS5420667U - - Google Patents
Info
- Publication number
- JPS5420667U JPS5420667U JP1977094293U JP9429377U JPS5420667U JP S5420667 U JPS5420667 U JP S5420667U JP 1977094293 U JP1977094293 U JP 1977094293U JP 9429377 U JP9429377 U JP 9429377U JP S5420667 U JPS5420667 U JP S5420667U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977094293U JPS5420667U (ja) | 1977-07-14 | 1977-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977094293U JPS5420667U (ja) | 1977-07-14 | 1977-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5420667U true JPS5420667U (ja) | 1979-02-09 |
Family
ID=29026154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977094293U Pending JPS5420667U (ja) | 1977-07-14 | 1977-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5420667U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471967U (ja) * | 1977-10-31 | 1979-05-22 | ||
| JPS6038842A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | ピングリッドアレイ型半導体パッケージ |
-
1977
- 1977-07-14 JP JP1977094293U patent/JPS5420667U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471967U (ja) * | 1977-10-31 | 1979-05-22 | ||
| JPS6038842A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | ピングリッドアレイ型半導体パッケージ |