JPS54182859U - - Google Patents
Info
- Publication number
- JPS54182859U JPS54182859U JP8107878U JP8107878U JPS54182859U JP S54182859 U JPS54182859 U JP S54182859U JP 8107878 U JP8107878 U JP 8107878U JP 8107878 U JP8107878 U JP 8107878U JP S54182859 U JPS54182859 U JP S54182859U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8107878U JPS54182859U (enExample) | 1978-06-15 | 1978-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8107878U JPS54182859U (enExample) | 1978-06-15 | 1978-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54182859U true JPS54182859U (enExample) | 1979-12-25 |
Family
ID=29000575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8107878U Pending JPS54182859U (enExample) | 1978-06-15 | 1978-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54182859U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009514250A (ja) * | 2005-11-01 | 2009-04-02 | アレグロ・マイクロシステムズ・インコーポレーテッド | フリップチップ・オン・リード半導体パッケージの方法および装置 |
| US9299915B2 (en) | 2012-01-16 | 2016-03-29 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| JP2017083597A (ja) * | 2015-10-27 | 2017-05-18 | 三菱電機株式会社 | 波長多重光通信モジュール |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
-
1978
- 1978-06-15 JP JP8107878U patent/JPS54182859U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009514250A (ja) * | 2005-11-01 | 2009-04-02 | アレグロ・マイクロシステムズ・インコーポレーテッド | フリップチップ・オン・リード半導体パッケージの方法および装置 |
| JP2013219369A (ja) * | 2005-11-01 | 2013-10-24 | Allegro Microsystems Llc | フリップチップ・オン・リード半導体パッケージの方法および装置 |
| KR101340576B1 (ko) * | 2005-11-01 | 2013-12-11 | 알레그로 마이크로시스템스, 엘엘씨 | 플립 칩 온 리드 반도체 패키지 방법 및 장치 |
| US9299915B2 (en) | 2012-01-16 | 2016-03-29 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| US10333055B2 (en) | 2012-01-16 | 2019-06-25 | Allegro Microsystems, Llc | Methods for magnetic sensor having non-conductive die paddle |
| JP2017083597A (ja) * | 2015-10-27 | 2017-05-18 | 三菱電機株式会社 | 波長多重光通信モジュール |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |