JPS5416976B2 - - Google Patents
Info
- Publication number
- JPS5416976B2 JPS5416976B2 JP10087375A JP10087375A JPS5416976B2 JP S5416976 B2 JPS5416976 B2 JP S5416976B2 JP 10087375 A JP10087375 A JP 10087375A JP 10087375 A JP10087375 A JP 10087375A JP S5416976 B2 JPS5416976 B2 JP S5416976B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10087375A JPS5224289A (en) | 1975-08-20 | 1975-08-20 | Process for preparing copper-plated laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10087375A JPS5224289A (en) | 1975-08-20 | 1975-08-20 | Process for preparing copper-plated laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5224289A JPS5224289A (en) | 1977-02-23 |
| JPS5416976B2 true JPS5416976B2 (OSRAM) | 1979-06-26 |
Family
ID=14285424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10087375A Granted JPS5224289A (en) | 1975-08-20 | 1975-08-20 | Process for preparing copper-plated laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5224289A (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54162174A (en) * | 1978-06-14 | 1979-12-22 | Sumitomo Bakelite Co | Method of producing flexible printed circuit board |
| JP6744859B2 (ja) * | 2015-03-31 | 2020-08-19 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
| JP7056201B2 (ja) * | 2018-02-14 | 2022-04-19 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
| JP7095305B2 (ja) * | 2018-02-15 | 2022-07-05 | 昭和電工マテリアルズ株式会社 | ビスマレイミド化合物とその中間体、並びに、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
-
1975
- 1975-08-20 JP JP10087375A patent/JPS5224289A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5224289A (en) | 1977-02-23 |