JPS54161069A - Antiifluidization method of solder - Google Patents
Antiifluidization method of solderInfo
- Publication number
- JPS54161069A JPS54161069A JP6987878A JP6987878A JPS54161069A JP S54161069 A JPS54161069 A JP S54161069A JP 6987878 A JP6987878 A JP 6987878A JP 6987878 A JP6987878 A JP 6987878A JP S54161069 A JPS54161069 A JP S54161069A
- Authority
- JP
- Japan
- Prior art keywords
- antiifluidization
- solder
- antiifluidization method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6987878A JPS54161069A (en) | 1978-06-12 | 1978-06-12 | Antiifluidization method of solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6987878A JPS54161069A (en) | 1978-06-12 | 1978-06-12 | Antiifluidization method of solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54161069A true JPS54161069A (en) | 1979-12-20 |
Family
ID=13415467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6987878A Pending JPS54161069A (en) | 1978-06-12 | 1978-06-12 | Antiifluidization method of solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54161069A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6249272U (ja) * | 1985-08-20 | 1987-03-26 | ||
| JP2000162070A (ja) * | 1998-11-27 | 2000-06-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
| US8053685B2 (en) | 2007-04-25 | 2011-11-08 | Denso Corportion | Metal wiring plate |
| WO2015083249A1 (ja) * | 2013-12-04 | 2015-06-11 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5077862A (ja) * | 1973-11-14 | 1975-06-25 | ||
| JPS526467A (en) * | 1975-07-07 | 1977-01-18 | Toshiba Corp | Manufacturing method of semi-conductors |
-
1978
- 1978-06-12 JP JP6987878A patent/JPS54161069A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5077862A (ja) * | 1973-11-14 | 1975-06-25 | ||
| JPS526467A (en) * | 1975-07-07 | 1977-01-18 | Toshiba Corp | Manufacturing method of semi-conductors |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6249272U (ja) * | 1985-08-20 | 1987-03-26 | ||
| JP2000162070A (ja) * | 1998-11-27 | 2000-06-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
| US8053685B2 (en) | 2007-04-25 | 2011-11-08 | Denso Corportion | Metal wiring plate |
| WO2015083249A1 (ja) * | 2013-12-04 | 2015-06-11 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |
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