JPS54158059A - Clarification treatment method for plating waste water - Google Patents

Clarification treatment method for plating waste water

Info

Publication number
JPS54158059A
JPS54158059A JP6613278A JP6613278A JPS54158059A JP S54158059 A JPS54158059 A JP S54158059A JP 6613278 A JP6613278 A JP 6613278A JP 6613278 A JP6613278 A JP 6613278A JP S54158059 A JPS54158059 A JP S54158059A
Authority
JP
Japan
Prior art keywords
waste water
added
adjust
plating waste
treatment method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6613278A
Other languages
Japanese (ja)
Other versions
JPS5725280B2 (en
Inventor
Mitsusaku Otsubo
Yukio Okuyama
Osamu Saburi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP6613278A priority Critical patent/JPS54158059A/en
Publication of JPS54158059A publication Critical patent/JPS54158059A/en
Publication of JPS5725280B2 publication Critical patent/JPS5725280B2/ja
Granted legal-status Critical Current

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  • Removal Of Specific Substances (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)

Abstract

PURPOSE: To decompose and remove organic contaminants contained in chemical copper plating waste water at a high removal rate by adding palladiym chloride to the waste water kept at high pH, heating the waste water to form precipitation, removing the precipitation, subjecting the waste water to oxidizing treatment at low pH, and containing the waste water with activated carbon.
CONSTITUTION: Chemical copper plating waste water containing such contaminants as EDTA, formaldehyde, and copper is added with an alkali agent to adjust the pH to above 12, added with palladium chloride, and heated to 30W80°C. After removal of resulting precipitate, the waste water is added with a mineral acid to adjust the pH to within 1W3. added with an oxidizer for oxidizing treatment, again added with a mineral acid to adjust the pH to within 2W4, added with activated carbon, and subjected to solid-liquid separation treatment to provide treated water.
COPYRIGHT: (C)1979,JPO&Japio
JP6613278A 1978-05-31 1978-05-31 Clarification treatment method for plating waste water Granted JPS54158059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6613278A JPS54158059A (en) 1978-05-31 1978-05-31 Clarification treatment method for plating waste water

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6613278A JPS54158059A (en) 1978-05-31 1978-05-31 Clarification treatment method for plating waste water

Publications (2)

Publication Number Publication Date
JPS54158059A true JPS54158059A (en) 1979-12-13
JPS5725280B2 JPS5725280B2 (en) 1982-05-28

Family

ID=13307026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6613278A Granted JPS54158059A (en) 1978-05-31 1978-05-31 Clarification treatment method for plating waste water

Country Status (1)

Country Link
JP (1) JPS54158059A (en)

Also Published As

Publication number Publication date
JPS5725280B2 (en) 1982-05-28

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