JPS54157561U - - Google Patents
Info
- Publication number
- JPS54157561U JPS54157561U JP1978053870U JP5387078U JPS54157561U JP S54157561 U JPS54157561 U JP S54157561U JP 1978053870 U JP1978053870 U JP 1978053870U JP 5387078 U JP5387078 U JP 5387078U JP S54157561 U JPS54157561 U JP S54157561U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1978053870U JPS54157561U (ja) | 1978-04-21 | 1978-04-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1978053870U JPS54157561U (ja) | 1978-04-21 | 1978-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54157561U true JPS54157561U (ja) | 1979-11-01 |
Family
ID=28947543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1978053870U Pending JPS54157561U (ja) | 1978-04-21 | 1978-04-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54157561U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59229827A (ja) * | 1983-06-07 | 1984-12-24 | Rohm Co Ltd | 半導体ペレツトのダイボンデングにおける金線マウント方法 |
JPS60130637U (ja) * | 1984-02-09 | 1985-09-02 | 日本電気株式会社 | ソルダ−供給ユニツト |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51131271A (en) * | 1975-05-12 | 1976-11-15 | Toshiba Corp | Semi-conductor unit |
-
1978
- 1978-04-21 JP JP1978053870U patent/JPS54157561U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51131271A (en) * | 1975-05-12 | 1976-11-15 | Toshiba Corp | Semi-conductor unit |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59229827A (ja) * | 1983-06-07 | 1984-12-24 | Rohm Co Ltd | 半導体ペレツトのダイボンデングにおける金線マウント方法 |
JPS60130637U (ja) * | 1984-02-09 | 1985-09-02 | 日本電気株式会社 | ソルダ−供給ユニツト |