JPS54157561U - - Google Patents

Info

Publication number
JPS54157561U
JPS54157561U JP1978053870U JP5387078U JPS54157561U JP S54157561 U JPS54157561 U JP S54157561U JP 1978053870 U JP1978053870 U JP 1978053870U JP 5387078 U JP5387078 U JP 5387078U JP S54157561 U JPS54157561 U JP S54157561U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978053870U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978053870U priority Critical patent/JPS54157561U/ja
Publication of JPS54157561U publication Critical patent/JPS54157561U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1978053870U 1978-04-21 1978-04-21 Pending JPS54157561U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978053870U JPS54157561U (ja) 1978-04-21 1978-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978053870U JPS54157561U (ja) 1978-04-21 1978-04-21

Publications (1)

Publication Number Publication Date
JPS54157561U true JPS54157561U (ja) 1979-11-01

Family

ID=28947543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978053870U Pending JPS54157561U (ja) 1978-04-21 1978-04-21

Country Status (1)

Country Link
JP (1) JPS54157561U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229827A (ja) * 1983-06-07 1984-12-24 Rohm Co Ltd 半導体ペレツトのダイボンデングにおける金線マウント方法
JPS60130637U (ja) * 1984-02-09 1985-09-02 日本電気株式会社 ソルダ−供給ユニツト

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131271A (en) * 1975-05-12 1976-11-15 Toshiba Corp Semi-conductor unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131271A (en) * 1975-05-12 1976-11-15 Toshiba Corp Semi-conductor unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229827A (ja) * 1983-06-07 1984-12-24 Rohm Co Ltd 半導体ペレツトのダイボンデングにおける金線マウント方法
JPS60130637U (ja) * 1984-02-09 1985-09-02 日本電気株式会社 ソルダ−供給ユニツト

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