JPS54156171A - Metallfoil lined board for printed circuit - Google Patents

Metallfoil lined board for printed circuit

Info

Publication number
JPS54156171A
JPS54156171A JP6554778A JP6554778A JPS54156171A JP S54156171 A JPS54156171 A JP S54156171A JP 6554778 A JP6554778 A JP 6554778A JP 6554778 A JP6554778 A JP 6554778A JP S54156171 A JPS54156171 A JP S54156171A
Authority
JP
Japan
Prior art keywords
metallfoil
printed circuit
lined board
lined
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6554778A
Other languages
Japanese (ja)
Other versions
JPS6227557B2 (en
Inventor
Jinzou Kosuge
Taruyoshi Oosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP6554778A priority Critical patent/JPS54156171A/en
Publication of JPS54156171A publication Critical patent/JPS54156171A/en
Publication of JPS6227557B2 publication Critical patent/JPS6227557B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6554778A 1978-05-31 1978-05-31 Metallfoil lined board for printed circuit Granted JPS54156171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6554778A JPS54156171A (en) 1978-05-31 1978-05-31 Metallfoil lined board for printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6554778A JPS54156171A (en) 1978-05-31 1978-05-31 Metallfoil lined board for printed circuit

Publications (2)

Publication Number Publication Date
JPS54156171A true JPS54156171A (en) 1979-12-08
JPS6227557B2 JPS6227557B2 (en) 1987-06-15

Family

ID=13290139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6554778A Granted JPS54156171A (en) 1978-05-31 1978-05-31 Metallfoil lined board for printed circuit

Country Status (1)

Country Link
JP (1) JPS54156171A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019654A (en) * 2004-07-05 2006-01-19 Hitachi Chem Co Ltd Multi-layer wiring board and its manufacturing method
JP2008111169A (en) * 2006-10-31 2008-05-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil, surface-treated copper foil with extremely thin primer resin layer, and method of manufacturing the surface-treated copper foil and method of manufacturing the surface-treated copper foil with extremely thin primer resin layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980577A (en) * 1972-12-11 1974-08-03
JPS52135840A (en) * 1976-05-10 1977-11-14 Hitachi Ltd Surface treatment of copper member

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980577A (en) * 1972-12-11 1974-08-03
JPS52135840A (en) * 1976-05-10 1977-11-14 Hitachi Ltd Surface treatment of copper member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019654A (en) * 2004-07-05 2006-01-19 Hitachi Chem Co Ltd Multi-layer wiring board and its manufacturing method
JP2008111169A (en) * 2006-10-31 2008-05-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil, surface-treated copper foil with extremely thin primer resin layer, and method of manufacturing the surface-treated copper foil and method of manufacturing the surface-treated copper foil with extremely thin primer resin layer

Also Published As

Publication number Publication date
JPS6227557B2 (en) 1987-06-15

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