JPS54156171A - Metallfoil lined board for printed circuit - Google Patents
Metallfoil lined board for printed circuitInfo
- Publication number
- JPS54156171A JPS54156171A JP6554778A JP6554778A JPS54156171A JP S54156171 A JPS54156171 A JP S54156171A JP 6554778 A JP6554778 A JP 6554778A JP 6554778 A JP6554778 A JP 6554778A JP S54156171 A JPS54156171 A JP S54156171A
- Authority
- JP
- Japan
- Prior art keywords
- metallfoil
- printed circuit
- lined board
- lined
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554778A JPS54156171A (en) | 1978-05-31 | 1978-05-31 | Metallfoil lined board for printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554778A JPS54156171A (en) | 1978-05-31 | 1978-05-31 | Metallfoil lined board for printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54156171A true JPS54156171A (en) | 1979-12-08 |
JPS6227557B2 JPS6227557B2 (en) | 1987-06-15 |
Family
ID=13290139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6554778A Granted JPS54156171A (en) | 1978-05-31 | 1978-05-31 | Metallfoil lined board for printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54156171A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019654A (en) * | 2004-07-05 | 2006-01-19 | Hitachi Chem Co Ltd | Multi-layer wiring board and its manufacturing method |
JP2008111169A (en) * | 2006-10-31 | 2008-05-15 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil, surface-treated copper foil with extremely thin primer resin layer, and method of manufacturing the surface-treated copper foil and method of manufacturing the surface-treated copper foil with extremely thin primer resin layer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4980577A (en) * | 1972-12-11 | 1974-08-03 | ||
JPS52135840A (en) * | 1976-05-10 | 1977-11-14 | Hitachi Ltd | Surface treatment of copper member |
-
1978
- 1978-05-31 JP JP6554778A patent/JPS54156171A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4980577A (en) * | 1972-12-11 | 1974-08-03 | ||
JPS52135840A (en) * | 1976-05-10 | 1977-11-14 | Hitachi Ltd | Surface treatment of copper member |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019654A (en) * | 2004-07-05 | 2006-01-19 | Hitachi Chem Co Ltd | Multi-layer wiring board and its manufacturing method |
JP2008111169A (en) * | 2006-10-31 | 2008-05-15 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil, surface-treated copper foil with extremely thin primer resin layer, and method of manufacturing the surface-treated copper foil and method of manufacturing the surface-treated copper foil with extremely thin primer resin layer |
Also Published As
Publication number | Publication date |
---|---|
JPS6227557B2 (en) | 1987-06-15 |
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