JPS5415394B2 - - Google Patents

Info

Publication number
JPS5415394B2
JPS5415394B2 JP8042974A JP8042974A JPS5415394B2 JP S5415394 B2 JPS5415394 B2 JP S5415394B2 JP 8042974 A JP8042974 A JP 8042974A JP 8042974 A JP8042974 A JP 8042974A JP S5415394 B2 JPS5415394 B2 JP S5415394B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8042974A
Other languages
Japanese (ja)
Other versions
JPS519576A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49080429A priority Critical patent/JPS519576A/ja
Publication of JPS519576A publication Critical patent/JPS519576A/ja
Publication of JPS5415394B2 publication Critical patent/JPS5415394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
JP49080429A 1974-07-12 1974-07-12 Handotaisochino seizoho Granted JPS519576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49080429A JPS519576A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49080429A JPS519576A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Publications (2)

Publication Number Publication Date
JPS519576A JPS519576A (en) 1976-01-26
JPS5415394B2 true JPS5415394B2 (enrdf_load_stackoverflow) 1979-06-14

Family

ID=13718020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49080429A Granted JPS519576A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Country Status (1)

Country Link
JP (1) JPS519576A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987840A (ja) * 1982-11-10 1984-05-21 Toray Silicone Co Ltd 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514904B2 (enrdf_load_stackoverflow) * 1971-11-30 1976-02-16

Also Published As

Publication number Publication date
JPS519576A (en) 1976-01-26

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