JPS54153888A - Production of copper-clad laminate - Google Patents

Production of copper-clad laminate

Info

Publication number
JPS54153888A
JPS54153888A JP6258178A JP6258178A JPS54153888A JP S54153888 A JPS54153888 A JP S54153888A JP 6258178 A JP6258178 A JP 6258178A JP 6258178 A JP6258178 A JP 6258178A JP S54153888 A JPS54153888 A JP S54153888A
Authority
JP
Japan
Prior art keywords
copper
laminated
resin
clad laminate
fiberboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6258178A
Other languages
Japanese (ja)
Inventor
Takeo Kaneoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP6258178A priority Critical patent/JPS54153888A/en
Publication of JPS54153888A publication Critical patent/JPS54153888A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: Prepregs are laminated on both surfaces of a resin-containing fiberboard that is previously dried to a specific water content, then a copper foil is laminated thereon and they are hot pressed to produce said copper-clad laminate excellent in electrical properties, etching operability, and punching processability.
CONSTITUTION: A resin-containing fiberboard formed by pressing a fibrous material impregnated with a resin as a binder is dried to the water content of lower than 8%, preferably lower than 5%. Prepregs are laminated on both surfaces of the fiberboard at least one layer respectively and copper foils are applied onto the one surface or both surfaces of the laminate, they are hot pressed for integration.
COPYRIGHT: (C)1979,JPO&Japio
JP6258178A 1978-05-25 1978-05-25 Production of copper-clad laminate Pending JPS54153888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6258178A JPS54153888A (en) 1978-05-25 1978-05-25 Production of copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6258178A JPS54153888A (en) 1978-05-25 1978-05-25 Production of copper-clad laminate

Publications (1)

Publication Number Publication Date
JPS54153888A true JPS54153888A (en) 1979-12-04

Family

ID=13204420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6258178A Pending JPS54153888A (en) 1978-05-25 1978-05-25 Production of copper-clad laminate

Country Status (1)

Country Link
JP (1) JPS54153888A (en)

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