JPS54149467A - Method of plating ceramic package portion for semiconductor device - Google Patents

Method of plating ceramic package portion for semiconductor device

Info

Publication number
JPS54149467A
JPS54149467A JP5784278A JP5784278A JPS54149467A JP S54149467 A JPS54149467 A JP S54149467A JP 5784278 A JP5784278 A JP 5784278A JP 5784278 A JP5784278 A JP 5784278A JP S54149467 A JPS54149467 A JP S54149467A
Authority
JP
Japan
Prior art keywords
semiconductor device
ceramic package
package portion
plating ceramic
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5784278A
Other languages
Japanese (ja)
Inventor
Sumio Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP5784278A priority Critical patent/JPS54149467A/en
Publication of JPS54149467A publication Critical patent/JPS54149467A/en
Pending legal-status Critical Current

Links

JP5784278A 1978-05-16 1978-05-16 Method of plating ceramic package portion for semiconductor device Pending JPS54149467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5784278A JPS54149467A (en) 1978-05-16 1978-05-16 Method of plating ceramic package portion for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5784278A JPS54149467A (en) 1978-05-16 1978-05-16 Method of plating ceramic package portion for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54149467A true JPS54149467A (en) 1979-11-22

Family

ID=13067217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5784278A Pending JPS54149467A (en) 1978-05-16 1978-05-16 Method of plating ceramic package portion for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54149467A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540165A (en) * 1994-04-13 1996-07-30 Aisin Seiki Kabushiki Kaisha Sewing head driving apparatus for a sewing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540165A (en) * 1994-04-13 1996-07-30 Aisin Seiki Kabushiki Kaisha Sewing head driving apparatus for a sewing machine

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