JPS54139065A - Resist for production of metalic through hole type printed circuit board - Google Patents

Resist for production of metalic through hole type printed circuit board

Info

Publication number
JPS54139065A
JPS54139065A JP4593578A JP4593578A JPS54139065A JP S54139065 A JPS54139065 A JP S54139065A JP 4593578 A JP4593578 A JP 4593578A JP 4593578 A JP4593578 A JP 4593578A JP S54139065 A JPS54139065 A JP S54139065A
Authority
JP
Japan
Prior art keywords
metalic
resist
production
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4593578A
Other languages
Japanese (ja)
Other versions
JPS5713160B2 (en
Inventor
Hiroyuki Akiyama
Shiyouhei Yoshimura
Jirou Nakazawa
Isao Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSP Corp
Kyoritsu Kogyo KK
Original Assignee
JSP Corp
Kyoritsu Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSP Corp, Kyoritsu Kogyo KK filed Critical JSP Corp
Priority to JP4593578A priority Critical patent/JPS54139065A/en
Publication of JPS54139065A publication Critical patent/JPS54139065A/en
Publication of JPS5713160B2 publication Critical patent/JPS5713160B2/ja
Granted legal-status Critical Current

Links

JP4593578A 1978-04-20 1978-04-20 Resist for production of metalic through hole type printed circuit board Granted JPS54139065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4593578A JPS54139065A (en) 1978-04-20 1978-04-20 Resist for production of metalic through hole type printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4593578A JPS54139065A (en) 1978-04-20 1978-04-20 Resist for production of metalic through hole type printed circuit board

Publications (2)

Publication Number Publication Date
JPS54139065A true JPS54139065A (en) 1979-10-29
JPS5713160B2 JPS5713160B2 (en) 1982-03-15

Family

ID=12733117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4593578A Granted JPS54139065A (en) 1978-04-20 1978-04-20 Resist for production of metalic through hole type printed circuit board

Country Status (1)

Country Link
JP (1) JPS54139065A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599796A (en) * 1979-01-26 1980-07-30 Sanwa Kagaku Kogyo Kk Method of fabricating copper throughhhole printed circuit board
JPS55102290A (en) * 1979-01-26 1980-08-05 Sanwa Kagaku Kogyo Kk Ink for filling hole of copper through hole printed circuit board
JPS61212092A (en) * 1985-03-18 1986-09-20 サンワ化学工業株式会社 Hole stopping ink for copper through hole printed wiring board
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6840425B2 (en) 2000-05-31 2005-01-11 Ttm Advanced Circuits, Inc. Scavenging system
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599796A (en) * 1979-01-26 1980-07-30 Sanwa Kagaku Kogyo Kk Method of fabricating copper throughhhole printed circuit board
JPS55102290A (en) * 1979-01-26 1980-08-05 Sanwa Kagaku Kogyo Kk Ink for filling hole of copper through hole printed circuit board
JPS61212092A (en) * 1985-03-18 1986-09-20 サンワ化学工業株式会社 Hole stopping ink for copper through hole printed wiring board
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6797224B2 (en) 2000-05-31 2004-09-28 Ttm Advanced Technologies, Inc. Heated filling method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6840425B2 (en) 2000-05-31 2005-01-11 Ttm Advanced Circuits, Inc. Scavenging system
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6921505B2 (en) 2000-05-31 2005-07-26 Ttm Advanced Circuits, Inc. Hole filling using an etched hole-fill stand-off
US6995321B2 (en) 2000-05-31 2006-02-07 Honeywell Advanced Circuits Etched hole-fill stand-off
US7066378B2 (en) 2000-05-31 2006-06-27 Ttm Advanced Circuits, Inc. Filling device

Also Published As

Publication number Publication date
JPS5713160B2 (en) 1982-03-15

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