JPS54132168A - Device for forming mutual connecting structure of aluminum on ic chip - Google Patents

Device for forming mutual connecting structure of aluminum on ic chip

Info

Publication number
JPS54132168A
JPS54132168A JP3498579A JP3498579A JPS54132168A JP S54132168 A JPS54132168 A JP S54132168A JP 3498579 A JP3498579 A JP 3498579A JP 3498579 A JP3498579 A JP 3498579A JP S54132168 A JPS54132168 A JP S54132168A
Authority
JP
Japan
Prior art keywords
chip
aluminum
connecting structure
mutual connecting
forming mutual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3498579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6217378B2 (enExample
Inventor
Kiyansereri Dan
Ii Tonpuson Chiyaaruzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of JPS54132168A publication Critical patent/JPS54132168A/ja
Publication of JPS6217378B2 publication Critical patent/JPS6217378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
JP3498579A 1978-04-03 1979-03-20 Device for forming mutual connecting structure of aluminum on ic chip Granted JPS54132168A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/892,916 US4192729A (en) 1978-04-03 1978-04-03 Apparatus for forming an aluminum interconnect structure on an integrated circuit chip

Publications (2)

Publication Number Publication Date
JPS54132168A true JPS54132168A (en) 1979-10-13
JPS6217378B2 JPS6217378B2 (enExample) 1987-04-17

Family

ID=25400706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3498579A Granted JPS54132168A (en) 1978-04-03 1979-03-20 Device for forming mutual connecting structure of aluminum on ic chip

Country Status (2)

Country Link
US (1) US4192729A (enExample)
JP (1) JPS54132168A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0523677A3 (en) * 1991-07-16 1994-10-19 Canon Kk Method and apparatus for anodic oxidation treatment
US5441618A (en) * 1992-11-10 1995-08-15 Casio Computer Co., Ltd. Anodizing apparatus and an anodizing method
JP3308333B2 (ja) * 1993-03-30 2002-07-29 三菱電機株式会社 電解メッキ装置，及び電解メッキ処理方法
US5580825A (en) * 1993-09-20 1996-12-03 International Technology Exchange Corp. Process for making multilevel interconnections of electronic components
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6805778B1 (en) 1996-07-15 2004-10-19 Semitool, Inc. Contact assembly for supplying power to workpieces during electrochemical processing
US6358388B1 (en) * 1996-07-15 2002-03-19 Semitool, Inc. Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
US6001234A (en) * 1997-09-30 1999-12-14 Semitool, Inc. Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
US20020000380A1 (en) * 1999-10-28 2002-01-03 Lyndon W. Graham Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece
US6460404B1 (en) * 2000-10-12 2002-10-08 Chartered Semiconductor Manufacturing Ltd. Apparatus and method for detecting bad edge bead removal in a spin-on-glass coater tool
US6627052B2 (en) * 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
US20040178065A1 (en) * 2001-03-16 2004-09-16 Semitool, Inc. Electrode semiconductor workpiece holder and processing methods
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3317410A (en) * 1962-12-18 1967-05-02 Ibm Agitation system for electrodeposition of magnetic alloys
US3554891A (en) * 1967-12-22 1971-01-12 Ibm Automatic impurity profiling machine
US3536594A (en) * 1968-07-05 1970-10-27 Western Electric Co Method and apparatus for rapid gold plating integrated circuit slices
US3732159A (en) * 1970-04-17 1973-05-08 Corning Glass Works Flow-through chamber for analysis of continuously flowing sample solution
DE2051710B2 (de) * 1970-10-21 1975-09-04 Robert Bosch Gmbh, 7000 Stuttgart Maschine für die elektrochemische Metallbearbeitung mit mehreren Bearbeitungsstellen
US3745100A (en) * 1971-12-22 1973-07-10 Us Army Method of preparing semiporous film of aluminum oxide voltage anodization
US3909368A (en) * 1974-07-12 1975-09-30 Louis W Raymond Electroplating method and apparatus
US4118303A (en) * 1976-08-30 1978-10-03 Burroughs Corporation Apparatus for chemically treating a single side of a workpiece

Also Published As

Publication number Publication date
JPS6217378B2 (enExample) 1987-04-17
US4192729A (en) 1980-03-11

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