JPS5412264A - Ultrasonic bonding tool - Google Patents

Ultrasonic bonding tool

Info

Publication number
JPS5412264A
JPS5412264A JP7738177A JP7738177A JPS5412264A JP S5412264 A JPS5412264 A JP S5412264A JP 7738177 A JP7738177 A JP 7738177A JP 7738177 A JP7738177 A JP 7738177A JP S5412264 A JPS5412264 A JP S5412264A
Authority
JP
Japan
Prior art keywords
ultrasonic bonding
bonding tool
ultrasonic
tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7738177A
Other languages
Japanese (ja)
Other versions
JPS6019659B2 (en
Inventor
Jiyouji Koshiyou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP52077381A priority Critical patent/JPS6019659B2/en
Publication of JPS5412264A publication Critical patent/JPS5412264A/en
Publication of JPS6019659B2 publication Critical patent/JPS6019659B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
JP52077381A 1977-06-28 1977-06-28 Ultrasonic bonding tool Expired JPS6019659B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52077381A JPS6019659B2 (en) 1977-06-28 1977-06-28 Ultrasonic bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52077381A JPS6019659B2 (en) 1977-06-28 1977-06-28 Ultrasonic bonding tool

Publications (2)

Publication Number Publication Date
JPS5412264A true JPS5412264A (en) 1979-01-29
JPS6019659B2 JPS6019659B2 (en) 1985-05-17

Family

ID=13632304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52077381A Expired JPS6019659B2 (en) 1977-06-28 1977-06-28 Ultrasonic bonding tool

Country Status (1)

Country Link
JP (1) JPS6019659B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61245801A (en) * 1985-02-26 1986-11-01 ドイツチエ　ゲゼルシヤフト　フユール　ヴイーダーアウフアルバイツンクフオン　ケルンブレンシユトツフエン　ミツト　ベシユレンクテル　ハフツング Catch basin tower for countercurrent extraction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61245801A (en) * 1985-02-26 1986-11-01 ドイツチエ　ゲゼルシヤフト　フユール　ヴイーダーアウフアルバイツンクフオン　ケルンブレンシユトツフエン　ミツト　ベシユレンクテル　ハフツング Catch basin tower for countercurrent extraction

Also Published As

Publication number Publication date
JPS6019659B2 (en) 1985-05-17

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