JPS54117556A - Production of molded article of silicone rubber - Google Patents
Production of molded article of silicone rubberInfo
- Publication number
- JPS54117556A JPS54117556A JP2511778A JP2511778A JPS54117556A JP S54117556 A JPS54117556 A JP S54117556A JP 2511778 A JP2511778 A JP 2511778A JP 2511778 A JP2511778 A JP 2511778A JP S54117556 A JPS54117556 A JP S54117556A
- Authority
- JP
- Japan
- Prior art keywords
- directly bonded
- amount
- mold
- molded article
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To obtain a high-quality molded article of silicone rubber with ease and high productivity, by dipping a comparatively low-temperature mold into a specific liquid organopolysiloxane composition.
CONSTITUTION: A mold (made of aluminum, etc.) heated at 50W140°C is dipped into a liquid organopolysiloxane composition consisting of A) a diorganopolysiloxane having two or more alkenyl groups directly bonded to silicon atoms in one molecule shown by the formula I; (R is hydrocarbon; n is 1.9W2.1), B) an organohydrogenpolysiloxane having two or more hydrogen atoms directly bonded to silicon atoms in one molecule, C) an inorganic filler, e.g., finely divided silica, and D) a platinum catalyst. The mold is then taken out and heated at 100W350°C. Preferably the amount of B is enough quantity to give 0.5W2.5 hydrogen atoms directly bonded to silicon atoms in B to one alkenyl group directly bonded to a silicon atom in A; the amount of C is 10W200 parts by wt. based on 100 parts by wt. of A; the amount of D is 1W500 ppm calculated as platinum (weight ratio) based on A and B.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2511778A JPS54117556A (en) | 1978-03-06 | 1978-03-06 | Production of molded article of silicone rubber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2511778A JPS54117556A (en) | 1978-03-06 | 1978-03-06 | Production of molded article of silicone rubber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54117556A true JPS54117556A (en) | 1979-09-12 |
Family
ID=12156975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2511778A Pending JPS54117556A (en) | 1978-03-06 | 1978-03-06 | Production of molded article of silicone rubber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54117556A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58201609A (en) * | 1982-05-18 | 1983-11-24 | Sumitomo Electric Ind Ltd | Preparation of container for hydrostatic forming |
| JPS59204526A (en) * | 1983-05-09 | 1984-11-19 | Toray Silicone Co Ltd | Preparation of molded silicone rubber article |
| JPS6023018A (en) * | 1983-04-15 | 1985-02-05 | Shinagawa Shoko Kk | Preparation of silicone rubber molded piece in high temperature region |
| JPS6372775A (en) * | 1986-09-16 | 1988-04-02 | Toshiba Silicone Co Ltd | Bonding composition |
| CN108250762A (en) * | 2018-01-19 | 2018-07-06 | 扬州宏远新材料股份有限公司 | A kind of high viscosity mold glue and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51139853A (en) * | 1975-05-28 | 1976-12-02 | Toshiba Silicone Co Ltd | A heat curable silicone rubber composition |
-
1978
- 1978-03-06 JP JP2511778A patent/JPS54117556A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51139853A (en) * | 1975-05-28 | 1976-12-02 | Toshiba Silicone Co Ltd | A heat curable silicone rubber composition |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58201609A (en) * | 1982-05-18 | 1983-11-24 | Sumitomo Electric Ind Ltd | Preparation of container for hydrostatic forming |
| JPH0117448B2 (en) * | 1982-05-18 | 1989-03-30 | Sumitomo Electric Industries | |
| JPS6023018A (en) * | 1983-04-15 | 1985-02-05 | Shinagawa Shoko Kk | Preparation of silicone rubber molded piece in high temperature region |
| JPS59204526A (en) * | 1983-05-09 | 1984-11-19 | Toray Silicone Co Ltd | Preparation of molded silicone rubber article |
| JPH0326224B2 (en) * | 1983-05-09 | 1991-04-10 | Tore Daukooningu Shirikoon Kk | |
| JPS6372775A (en) * | 1986-09-16 | 1988-04-02 | Toshiba Silicone Co Ltd | Bonding composition |
| JPH0575793B2 (en) * | 1986-09-16 | 1993-10-21 | Toshiba Silicone | |
| CN108250762A (en) * | 2018-01-19 | 2018-07-06 | 扬州宏远新材料股份有限公司 | A kind of high viscosity mold glue and preparation method thereof |
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