JPS54116877A - Wire bonding unit - Google Patents

Wire bonding unit

Info

Publication number
JPS54116877A
JPS54116877A JP2408678A JP2408678A JPS54116877A JP S54116877 A JPS54116877 A JP S54116877A JP 2408678 A JP2408678 A JP 2408678A JP 2408678 A JP2408678 A JP 2408678A JP S54116877 A JPS54116877 A JP S54116877A
Authority
JP
Japan
Prior art keywords
wire
bonding
tool
filter
contaminant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2408678A
Other languages
Japanese (ja)
Inventor
Toshinori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2408678A priority Critical patent/JPS54116877A/en
Publication of JPS54116877A publication Critical patent/JPS54116877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE: To make bonding operation smooth with the loading of a bonding tool prevented by removing a contaminant sticking to a bonding wire by spraying compressed air to a bonding wire part before the insertion into the tool.
CONSTITUTION: Bonding wire 1 is inserted into a hole provided to bonding tool 6, and wire ball 7 is formed at the tip of wire 1 before bonding. Then bonding unit like this is provided with contaminant removal filter 3, through which wire 1 passes through, right over tool 6. Next, when wire 1 is depressed according to its consumption, gas is sprayed from compressed-gas spraying mouth 5 provided to filter 3 into the inside 2 of filter 3 in the direction of arrow 4. The contaminant sticking to wire, therefore, scatters, so that no loading will occur to tool 6.
COPYRIGHT: (C)1979,JPO&Japio
JP2408678A 1978-03-02 1978-03-02 Wire bonding unit Pending JPS54116877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2408678A JPS54116877A (en) 1978-03-02 1978-03-02 Wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2408678A JPS54116877A (en) 1978-03-02 1978-03-02 Wire bonding unit

Publications (1)

Publication Number Publication Date
JPS54116877A true JPS54116877A (en) 1979-09-11

Family

ID=12128576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2408678A Pending JPS54116877A (en) 1978-03-02 1978-03-02 Wire bonding unit

Country Status (1)

Country Link
JP (1) JPS54116877A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

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