JPS5411667A - Device for finely controlling position of tape bonding unit - Google Patents

Device for finely controlling position of tape bonding unit

Info

Publication number
JPS5411667A
JPS5411667A JP7693177A JP7693177A JPS5411667A JP S5411667 A JPS5411667 A JP S5411667A JP 7693177 A JP7693177 A JP 7693177A JP 7693177 A JP7693177 A JP 7693177A JP S5411667 A JPS5411667 A JP S5411667A
Authority
JP
Japan
Prior art keywords
bonding unit
tape bonding
controlling position
finely controlling
finely
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7693177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5753973B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
Seiichi Chiba
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP7693177A priority Critical patent/JPS5411667A/ja
Publication of JPS5411667A publication Critical patent/JPS5411667A/ja
Publication of JPS5753973B2 publication Critical patent/JPS5753973B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP7693177A 1977-06-27 1977-06-27 Device for finely controlling position of tape bonding unit Granted JPS5411667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7693177A JPS5411667A (en) 1977-06-27 1977-06-27 Device for finely controlling position of tape bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7693177A JPS5411667A (en) 1977-06-27 1977-06-27 Device for finely controlling position of tape bonding unit

Publications (2)

Publication Number Publication Date
JPS5411667A true JPS5411667A (en) 1979-01-27
JPS5753973B2 JPS5753973B2 (enrdf_load_stackoverflow) 1982-11-16

Family

ID=13619462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7693177A Granted JPS5411667A (en) 1977-06-27 1977-06-27 Device for finely controlling position of tape bonding unit

Country Status (1)

Country Link
JP (1) JPS5411667A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (ja) * 1986-12-27 1988-07-09 Shinkawa Ltd インナ−リ−ドボンデイング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143075A (en) * 1974-09-30 1976-04-13 Jeido Corp Za Handotaisochi mataha ruijibutsuniriidoo seikakunisetsugosurusochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143075A (en) * 1974-09-30 1976-04-13 Jeido Corp Za Handotaisochi mataha ruijibutsuniriidoo seikakunisetsugosurusochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (ja) * 1986-12-27 1988-07-09 Shinkawa Ltd インナ−リ−ドボンデイング装置

Also Published As

Publication number Publication date
JPS5753973B2 (enrdf_load_stackoverflow) 1982-11-16

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