JPS54111469U - - Google Patents

Info

Publication number
JPS54111469U
JPS54111469U JP767178U JP767178U JPS54111469U JP S54111469 U JPS54111469 U JP S54111469U JP 767178 U JP767178 U JP 767178U JP 767178 U JP767178 U JP 767178U JP S54111469 U JPS54111469 U JP S54111469U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP767178U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP767178U priority Critical patent/JPS54111469U/ja
Publication of JPS54111469U publication Critical patent/JPS54111469U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP767178U 1978-01-24 1978-01-24 Pending JPS54111469U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP767178U JPS54111469U (ja) 1978-01-24 1978-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP767178U JPS54111469U (ja) 1978-01-24 1978-01-24

Publications (1)

Publication Number Publication Date
JPS54111469U true JPS54111469U (ja) 1979-08-06

Family

ID=28815687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP767178U Pending JPS54111469U (ja) 1978-01-24 1978-01-24

Country Status (1)

Country Link
JP (1) JPS54111469U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028011A (ja) * 2006-07-19 2008-02-07 Denso Corp モールドパッケージおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028011A (ja) * 2006-07-19 2008-02-07 Denso Corp モールドパッケージおよびその製造方法

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