JPS5410846Y2 - - Google Patents
Info
- Publication number
- JPS5410846Y2 JPS5410846Y2 JP1974111763U JP11176374U JPS5410846Y2 JP S5410846 Y2 JPS5410846 Y2 JP S5410846Y2 JP 1974111763 U JP1974111763 U JP 1974111763U JP 11176374 U JP11176374 U JP 11176374U JP S5410846 Y2 JPS5410846 Y2 JP S5410846Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974111763U JPS5410846Y2 (cg-RX-API-DMAC7.html) | 1974-09-18 | 1974-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974111763U JPS5410846Y2 (cg-RX-API-DMAC7.html) | 1974-09-18 | 1974-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5139467U JPS5139467U (cg-RX-API-DMAC7.html) | 1976-03-24 |
| JPS5410846Y2 true JPS5410846Y2 (cg-RX-API-DMAC7.html) | 1979-05-17 |
Family
ID=28337376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974111763U Expired JPS5410846Y2 (cg-RX-API-DMAC7.html) | 1974-09-18 | 1974-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5410846Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5740528Y2 (cg-RX-API-DMAC7.html) * | 1977-01-21 | 1982-09-06 | ||
| JPS6136709A (ja) * | 1984-07-30 | 1986-02-21 | Nec Corp | 光フアイバ−結合装置 |
| US4722586A (en) * | 1985-04-12 | 1988-02-02 | Tektronix, Inc. | Electro-optical transducer module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458780A (en) * | 1967-09-27 | 1969-07-29 | Westinghouse Electric Corp | Wedge bonded leads for semiconductor devices |
-
1974
- 1974-09-18 JP JP1974111763U patent/JPS5410846Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5139467U (cg-RX-API-DMAC7.html) | 1976-03-24 |