JPS5410846Y2 - - Google Patents

Info

Publication number
JPS5410846Y2
JPS5410846Y2 JP1974111763U JP11176374U JPS5410846Y2 JP S5410846 Y2 JPS5410846 Y2 JP S5410846Y2 JP 1974111763 U JP1974111763 U JP 1974111763U JP 11176374 U JP11176374 U JP 11176374U JP S5410846 Y2 JPS5410846 Y2 JP S5410846Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1974111763U
Other versions
JPS5139467U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974111763U priority Critical patent/JPS5410846Y2/ja
Publication of JPS5139467U publication Critical patent/JPS5139467U/ja
Application granted granted Critical
Publication of JPS5410846Y2 publication Critical patent/JPS5410846Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1974111763U 1974-09-18 1974-09-18 Expired JPS5410846Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974111763U JPS5410846Y2 (ja) 1974-09-18 1974-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974111763U JPS5410846Y2 (ja) 1974-09-18 1974-09-18

Publications (2)

Publication Number Publication Date
JPS5139467U JPS5139467U (ja) 1976-03-24
JPS5410846Y2 true JPS5410846Y2 (ja) 1979-05-17

Family

ID=28337376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974111763U Expired JPS5410846Y2 (ja) 1974-09-18 1974-09-18

Country Status (1)

Country Link
JP (1) JPS5410846Y2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740528Y2 (ja) * 1977-01-21 1982-09-06
JPS6136709A (ja) * 1984-07-30 1986-02-21 Nec Corp 光フアイバ−結合装置
US4722586A (en) * 1985-04-12 1988-02-02 Tektronix, Inc. Electro-optical transducer module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458780A (en) * 1967-09-27 1969-07-29 Westinghouse Electric Corp Wedge bonded leads for semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458780A (en) * 1967-09-27 1969-07-29 Westinghouse Electric Corp Wedge bonded leads for semiconductor devices

Also Published As

Publication number Publication date
JPS5139467U (ja) 1976-03-24

Similar Documents

Publication Publication Date Title
JPS50109496A (ja)
FR2289386B3 (ja)
JPS50106825U (ja)
JPS50104271U (ja)
AU495028B2 (ja)
FR2292584B1 (ja)
AR198841Q (ja)
JPS50121307U (ja)
JPS50102303U (ja)
JPS50105483U (ja)
BG21327A2 (ja)
BE836964A (ja)
BG19639A1 (ja)
BG19682A1 (ja)
BG19903A1 (ja)
BG20001A1 (ja)
BG20447A1 (ja)
BG20459A1 (ja)
BG20643A1 (ja)
BG20852A1 (ja)
BG20988A1 (ja)
BG21133A1 (ja)
BG21288A1 (ja)
BG21290A1 (ja)
AU480540A (ja)