JPS54103747U - - Google Patents

Info

Publication number
JPS54103747U
JPS54103747U JP17844377U JP17844377U JPS54103747U JP S54103747 U JPS54103747 U JP S54103747U JP 17844377 U JP17844377 U JP 17844377U JP 17844377 U JP17844377 U JP 17844377U JP S54103747 U JPS54103747 U JP S54103747U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17844377U
Other languages
Japanese (ja)
Other versions
JPS5841188Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977178443U priority Critical patent/JPS5841188Y2/ja
Publication of JPS54103747U publication Critical patent/JPS54103747U/ja
Application granted granted Critical
Publication of JPS5841188Y2 publication Critical patent/JPS5841188Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Packaging Frangible Articles (AREA)
  • Wire Bonding (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
JP1977178443U 1977-12-29 1977-12-29 半導体用ボンデイングワイヤ−のスプ−ルケ−ス Expired JPS5841188Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977178443U JPS5841188Y2 (ja) 1977-12-29 1977-12-29 半導体用ボンデイングワイヤ−のスプ−ルケ−ス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977178443U JPS5841188Y2 (ja) 1977-12-29 1977-12-29 半導体用ボンデイングワイヤ−のスプ−ルケ−ス

Publications (2)

Publication Number Publication Date
JPS54103747U true JPS54103747U (enrdf_load_stackoverflow) 1979-07-21
JPS5841188Y2 JPS5841188Y2 (ja) 1983-09-17

Family

ID=29188907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977178443U Expired JPS5841188Y2 (ja) 1977-12-29 1977-12-29 半導体用ボンデイングワイヤ−のスプ−ルケ−ス

Country Status (1)

Country Link
JP (1) JPS5841188Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398832B1 (ko) 2001-10-31 2003-09-19 헤라우스오리엔탈하이텍 주식회사 본딩 와이어용 스풀 케이스 및 이 케이스를 사용한 스풀취급 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4422252Y1 (enrdf_load_stackoverflow) * 1967-04-11 1969-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4422252Y1 (enrdf_load_stackoverflow) * 1967-04-11 1969-09-19

Also Published As

Publication number Publication date
JPS5841188Y2 (ja) 1983-09-17

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