JPS54103673A - Sealing method of semiconductor device - Google Patents
Sealing method of semiconductor deviceInfo
- Publication number
- JPS54103673A JPS54103673A JP1094178A JP1094178A JPS54103673A JP S54103673 A JPS54103673 A JP S54103673A JP 1094178 A JP1094178 A JP 1094178A JP 1094178 A JP1094178 A JP 1094178A JP S54103673 A JPS54103673 A JP S54103673A
- Authority
- JP
- Japan
- Prior art keywords
- package
- stoppers
- fixing jig
- leads
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To perform sealing with high reliability and high yield by inserting stoppers between the leads having been brazed to ceramics thereby preventing lateral direction deviations and positioning the package to the center of a fixing jig.
CONSTITUTION: A fixing jig 13 is provided with movable metal bars to insert stoppers 21 between leads 15. The stoppers protrude to the outer side by the tapers 23 of the forcing out part so as to be able to move from the inner to the outer side on the side face of the fixing jig. When a package 11 is removed, the stoppers are pulled inward by springs 24. According to this method, the deviations of the package with respect to the fixing jig is determined by the accuracy of the leads brazed to the package and the seal ring and since this value is made about 0.2 to 0.4mm, the accuracy improves considerably and the workability, yield and quality of seam weld sealing improve.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1094178A JPS6034817B2 (en) | 1978-02-01 | 1978-02-01 | Method for sealing semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1094178A JPS6034817B2 (en) | 1978-02-01 | 1978-02-01 | Method for sealing semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54103673A true JPS54103673A (en) | 1979-08-15 |
JPS6034817B2 JPS6034817B2 (en) | 1985-08-10 |
Family
ID=11764227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1094178A Expired JPS6034817B2 (en) | 1978-02-01 | 1978-02-01 | Method for sealing semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6034817B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104771978A (en) * | 2015-04-28 | 2015-07-15 | 泸州北方化学工业有限公司 | Circulating gas washing-absorbing system and washing-absorbing method for air current type drying machine |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6218117U (en) * | 1985-07-16 | 1987-02-03 |
-
1978
- 1978-02-01 JP JP1094178A patent/JPS6034817B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104771978A (en) * | 2015-04-28 | 2015-07-15 | 泸州北方化学工业有限公司 | Circulating gas washing-absorbing system and washing-absorbing method for air current type drying machine |
Also Published As
Publication number | Publication date |
---|---|
JPS6034817B2 (en) | 1985-08-10 |
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