JPS5392383U - - Google Patents
Info
- Publication number
- JPS5392383U JPS5392383U JP17820476U JP17820476U JPS5392383U JP S5392383 U JPS5392383 U JP S5392383U JP 17820476 U JP17820476 U JP 17820476U JP 17820476 U JP17820476 U JP 17820476U JP S5392383 U JPS5392383 U JP S5392383U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17820476U JPS5392383U (ja) | 1976-12-27 | 1976-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17820476U JPS5392383U (ja) | 1976-12-27 | 1976-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5392383U true JPS5392383U (ja) | 1978-07-28 |
Family
ID=28785436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17820476U Pending JPS5392383U (ja) | 1976-12-27 | 1976-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5392383U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2149151A1 (de) * | 2007-05-24 | 2010-02-03 | Siemens AG Österreich | Kühlanordnung mit einem halbleiterbauelement |
| JP2010171104A (ja) * | 2009-01-21 | 2010-08-05 | Denso Corp | 半導体装置の実装構造 |
| JP2017135272A (ja) * | 2016-01-28 | 2017-08-03 | 新電元工業株式会社 | 電子部品の取付治具、及び、電子部品の取付方法 |
-
1976
- 1976-12-27 JP JP17820476U patent/JPS5392383U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2149151A1 (de) * | 2007-05-24 | 2010-02-03 | Siemens AG Österreich | Kühlanordnung mit einem halbleiterbauelement |
| JP2010171104A (ja) * | 2009-01-21 | 2010-08-05 | Denso Corp | 半導体装置の実装構造 |
| JP2017135272A (ja) * | 2016-01-28 | 2017-08-03 | 新電元工業株式会社 | 電子部品の取付治具、及び、電子部品の取付方法 |