JPS5389557U - - Google Patents

Info

Publication number
JPS5389557U
JPS5389557U JP1976172665U JP17266576U JPS5389557U JP S5389557 U JPS5389557 U JP S5389557U JP 1976172665 U JP1976172665 U JP 1976172665U JP 17266576 U JP17266576 U JP 17266576U JP S5389557 U JPS5389557 U JP S5389557U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976172665U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976172665U priority Critical patent/JPS5389557U/ja
Publication of JPS5389557U publication Critical patent/JPS5389557U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1976172665U 1976-12-24 1976-12-24 Pending JPS5389557U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976172665U JPS5389557U (enrdf_load_html_response) 1976-12-24 1976-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976172665U JPS5389557U (enrdf_load_html_response) 1976-12-24 1976-12-24

Publications (1)

Publication Number Publication Date
JPS5389557U true JPS5389557U (enrdf_load_html_response) 1978-07-22

Family

ID=28780156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976172665U Pending JPS5389557U (enrdf_load_html_response) 1976-12-24 1976-12-24

Country Status (1)

Country Link
JP (1) JPS5389557U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348490A (ja) * 1989-07-17 1991-03-01 Canon Inc プリント配線基板の形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348490A (ja) * 1989-07-17 1991-03-01 Canon Inc プリント配線基板の形成方法

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