JPS5383936A - Automatic plating device - Google Patents
Automatic plating deviceInfo
- Publication number
- JPS5383936A JPS5383936A JP16017076A JP16017076A JPS5383936A JP S5383936 A JPS5383936 A JP S5383936A JP 16017076 A JP16017076 A JP 16017076A JP 16017076 A JP16017076 A JP 16017076A JP S5383936 A JPS5383936 A JP S5383936A
- Authority
- JP
- Japan
- Prior art keywords
- plating device
- automatic plating
- automatic
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16017076A JPS5383936A (en) | 1976-12-29 | 1976-12-29 | Automatic plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16017076A JPS5383936A (en) | 1976-12-29 | 1976-12-29 | Automatic plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5383936A true JPS5383936A (en) | 1978-07-24 |
JPS5520000B2 JPS5520000B2 (en) | 1980-05-30 |
Family
ID=15709357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16017076A Granted JPS5383936A (en) | 1976-12-29 | 1976-12-29 | Automatic plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5383936A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58185793A (en) * | 1982-04-23 | 1983-10-29 | Mitsubishi Electric Corp | Partial plating device for lead frame |
JPS59160558U (en) * | 1983-04-15 | 1984-10-27 | 凸版印刷株式会社 | partial plating device |
JPH02310393A (en) * | 1989-05-22 | 1990-12-26 | Nec Corp | Device for plating semiconductor substrate |
-
1976
- 1976-12-29 JP JP16017076A patent/JPS5383936A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58185793A (en) * | 1982-04-23 | 1983-10-29 | Mitsubishi Electric Corp | Partial plating device for lead frame |
JPS59160558U (en) * | 1983-04-15 | 1984-10-27 | 凸版印刷株式会社 | partial plating device |
JPS6245004Y2 (en) * | 1983-04-15 | 1987-11-30 | ||
JPH02310393A (en) * | 1989-05-22 | 1990-12-26 | Nec Corp | Device for plating semiconductor substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS5520000B2 (en) | 1980-05-30 |
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