JPS5378956A - Soldering method of two elements - Google Patents
Soldering method of two elementsInfo
- Publication number
- JPS5378956A JPS5378956A JP15596676A JP15596676A JPS5378956A JP S5378956 A JPS5378956 A JP S5378956A JP 15596676 A JP15596676 A JP 15596676A JP 15596676 A JP15596676 A JP 15596676A JP S5378956 A JPS5378956 A JP S5378956A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- soldering method
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15596676A JPS5378956A (en) | 1976-12-23 | 1976-12-23 | Soldering method of two elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15596676A JPS5378956A (en) | 1976-12-23 | 1976-12-23 | Soldering method of two elements |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5378956A true JPS5378956A (en) | 1978-07-12 |
JPS5649186B2 JPS5649186B2 (ja) | 1981-11-20 |
Family
ID=15617421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15596676A Granted JPS5378956A (en) | 1976-12-23 | 1976-12-23 | Soldering method of two elements |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5378956A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267825A (ja) * | 1992-03-18 | 1993-10-15 | Tokuyama Soda Co Ltd | プリコート基板の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092693A (ja) * | 1983-10-27 | 1985-05-24 | 富士通株式会社 | 高密度実装構造 |
JP7042282B2 (ja) | 2017-03-16 | 2022-03-25 | ライテン・インコーポレイテッド | 炭素及びエラストマーの融合 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822772U (ja) * | 1971-07-23 | 1973-03-15 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822772B1 (ja) * | 1970-05-15 | 1973-07-09 |
-
1976
- 1976-12-23 JP JP15596676A patent/JPS5378956A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822772U (ja) * | 1971-07-23 | 1973-03-15 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267825A (ja) * | 1992-03-18 | 1993-10-15 | Tokuyama Soda Co Ltd | プリコート基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5649186B2 (ja) | 1981-11-20 |
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