JPS5377212A - Ceramic substrate adhered with metal film and its manufacture - Google Patents
Ceramic substrate adhered with metal film and its manufactureInfo
- Publication number
- JPS5377212A JPS5377212A JP12586877A JP12586877A JPS5377212A JP S5377212 A JPS5377212 A JP S5377212A JP 12586877 A JP12586877 A JP 12586877A JP 12586877 A JP12586877 A JP 12586877A JP S5377212 A JPS5377212 A JP S5377212A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- metal film
- ceramic substrate
- substrate adhered
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T21/00—Apparatus or processes specially adapted for the manufacture or maintenance of spark gaps or sparking plugs
- H01T21/02—Apparatus or processes specially adapted for the manufacture or maintenance of spark gaps or sparking plugs of sparking plugs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73461876A | 1976-10-21 | 1976-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5377212A true JPS5377212A (en) | 1978-07-08 |
Family
ID=24952415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12586877A Pending JPS5377212A (en) | 1976-10-21 | 1977-10-21 | Ceramic substrate adhered with metal film and its manufacture |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5377212A (nl) |
BE (1) | BE859142A (nl) |
DE (1) | DE2746894A1 (nl) |
FR (1) | FR2368450A1 (nl) |
IT (1) | IT1087260B (nl) |
NL (1) | NL7711619A (nl) |
SE (1) | SE7711796L (nl) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU529792B2 (en) * | 1980-07-09 | 1983-06-23 | Matsushita Electric Industrial Co., Ltd. | Infrared radiative body |
DE3036128C2 (de) * | 1980-09-25 | 1983-08-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten |
EP0230853A1 (de) * | 1986-01-20 | 1987-08-05 | W. Blösch AG | Verfahren zur Herstellung einer lötfähigen Schicht aus einer Metallegierung auf einem Keramik-, insbesondere Oxydkeramiksubstrat |
CN112895061B (zh) * | 2020-11-22 | 2022-04-19 | 西北工业大学 | 选择性激光熔化制备圆柱状Al2O3-GdAlO3二元共晶陶瓷的方法 |
-
1977
- 1977-09-28 BE BE181265A patent/BE859142A/xx unknown
- 1977-10-19 SE SE7711796A patent/SE7711796L/xx unknown
- 1977-10-19 DE DE19772746894 patent/DE2746894A1/de active Pending
- 1977-10-20 FR FR7731585A patent/FR2368450A1/fr not_active Withdrawn
- 1977-10-20 IT IT28806/77A patent/IT1087260B/it active
- 1977-10-21 NL NL7711619A patent/NL7711619A/nl not_active Application Discontinuation
- 1977-10-21 JP JP12586877A patent/JPS5377212A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
IT1087260B (it) | 1985-06-04 |
NL7711619A (nl) | 1978-04-25 |
FR2368450A1 (fr) | 1978-05-19 |
DE2746894A1 (de) | 1978-04-27 |
BE859142A (fr) | 1978-01-16 |
SE7711796L (sv) | 1978-04-22 |
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