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Publication date
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Priority to JP6896573ApriorityCriticalpatent/JPS537274B2/ja
Publication of JPS5025174ApublicationCriticalpatent/JPS5025174A/ja
Publication of JPS537274B2publicationCriticalpatent/JPS537274B2/ja
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
B23D57/0069—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for tensioning saw wires
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Engineering & Computer Science
(AREA)
Mechanical Engineering
(AREA)
Crystals, And After-Treatments Of Crystals
(AREA)
Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed
(AREA)