JPS536755B2 - - Google Patents
Info
- Publication number
- JPS536755B2 JPS536755B2 JP3016773A JP3016773A JPS536755B2 JP S536755 B2 JPS536755 B2 JP S536755B2 JP 3016773 A JP3016773 A JP 3016773A JP 3016773 A JP3016773 A JP 3016773A JP S536755 B2 JPS536755 B2 JP S536755B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Paints Or Removers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00235651A US3817727A (en) | 1972-03-17 | 1972-03-17 | Abrasive polishing suspensions and method for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4913232A JPS4913232A (ja) | 1974-02-05 |
| JPS536755B2 true JPS536755B2 (ja) | 1978-03-10 |
Family
ID=22886391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3016773A Expired JPS536755B2 (ja) | 1972-03-17 | 1973-03-16 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3817727A (ja) |
| JP (1) | JPS536755B2 (ja) |
| CA (1) | CA972167A (ja) |
| FR (1) | FR2176798B1 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50144989A (ja) * | 1974-05-13 | 1975-11-21 | ||
| JPS5131793A (ja) * | 1974-09-13 | 1976-03-18 | Hitachi Chemical Co Ltd | Yuyoseifuenooruhokozokuhorumuarudehitojushi no seiho |
| US4038048A (en) * | 1975-02-14 | 1977-07-26 | Thrower Jr Herbert T | Lapping composition containing a carboxy vinyl polymer |
| FR2414071A1 (fr) * | 1978-01-05 | 1979-08-03 | Essilor Int | Materiau de polissage, notamment pour lentille ophtalmique en matiere organique |
| US4260396A (en) * | 1978-01-16 | 1981-04-07 | W. R. Grace & Co. | Compositions for polishing silicon and germanium |
| US4242842A (en) * | 1979-08-08 | 1981-01-06 | La Pierre Synthetique Baikowski, S.A. | Precision polishing suspension and method for making same |
| US4358295A (en) * | 1980-03-27 | 1982-11-09 | Matsushita Electric Industrial Co., Ltd. | Polishing method |
| RU2034889C1 (ru) * | 1993-04-02 | 1995-05-10 | Научно-производственное объединение "Алтай" | Композиция для суперфинишной доводки поверхности материала |
| EP0792515A1 (en) * | 1994-11-18 | 1997-09-03 | Advanced Micro Devices, Inc. | Method of making a chemical-mechanical polishing slurry and the polishing slurry |
| DE19642908A1 (de) * | 1996-10-17 | 1998-04-23 | Wacker Siltronic Halbleitermat | Sägesuspension und Verfahren zum Abtrennen von Scheiben von einem Kristall |
| US5916855A (en) * | 1997-03-26 | 1999-06-29 | Advanced Micro Devices, Inc. | Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films |
| US5855633A (en) * | 1997-06-06 | 1999-01-05 | Lockheed Martin Energy Systems, Inc. | Lapping slurry |
| US7332457B2 (en) | 2000-09-18 | 2008-02-19 | Honeywell International Inc. | Agricultural chemical suspensions |
| CN113718328B (zh) * | 2021-11-04 | 2022-02-11 | 山东裕航特种合金装备有限公司 | 一种船用铝合金铸件的表面处理方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2783137A (en) * | 1951-06-08 | 1957-02-26 | Dow Chemical Co | Grinding compositions and making of same |
| US3053646A (en) * | 1960-07-15 | 1962-09-11 | Dow Chemical Co | Grinding and polishing compositions and method of making same |
| NL263408A (ja) * | 1962-04-10 |
-
1972
- 1972-03-17 US US00235651A patent/US3817727A/en not_active Expired - Lifetime
-
1973
- 1973-03-14 CA CA166,932A patent/CA972167A/en not_active Expired
- 1973-03-16 FR FR7309511A patent/FR2176798B1/fr not_active Expired
- 1973-03-16 JP JP3016773A patent/JPS536755B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3817727A (en) | 1974-06-18 |
| DE2312372A1 (de) | 1973-09-20 |
| DE2312372B2 (de) | 1976-02-12 |
| JPS4913232A (ja) | 1974-02-05 |
| CA972167A (en) | 1975-08-05 |
| FR2176798A1 (ja) | 1973-11-02 |
| FR2176798B1 (ja) | 1976-05-21 |