JPS5364792A - Method of and device for inserting lead socket into electrically mutually connecting panel board - Google Patents

Method of and device for inserting lead socket into electrically mutually connecting panel board

Info

Publication number
JPS5364792A
JPS5364792A JP10867877A JP10867877A JPS5364792A JP S5364792 A JPS5364792 A JP S5364792A JP 10867877 A JP10867877 A JP 10867877A JP 10867877 A JP10867877 A JP 10867877A JP S5364792 A JPS5364792 A JP S5364792A
Authority
JP
Japan
Prior art keywords
board
holes
lead sockets
connecting panel
panel board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10867877A
Other languages
English (en)
Japanese (ja)
Inventor
Jii You Haabaato
Neruson Jiyon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Augat Inc
Original Assignee
Augat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augat Inc filed Critical Augat Inc
Publication of JPS5364792A publication Critical patent/JPS5364792A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49945—Assembling or joining by driven force fit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP10867877A 1976-11-22 1977-09-09 Method of and device for inserting lead socket into electrically mutually connecting panel board Pending JPS5364792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/744,135 US4089105A (en) 1976-11-22 1976-11-22 Method for mounting lead sockets to an electrical interconnection board

Publications (1)

Publication Number Publication Date
JPS5364792A true JPS5364792A (en) 1978-06-09

Family

ID=24991569

Family Applications (2)

Application Number Title Priority Date Filing Date
JP10867877A Pending JPS5364792A (en) 1976-11-22 1977-09-09 Method of and device for inserting lead socket into electrically mutually connecting panel board
JP1985165589U Pending JPS6180592U (OSRAM) 1976-11-22 1985-10-28

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1985165589U Pending JPS6180592U (OSRAM) 1976-11-22 1985-10-28

Country Status (5)

Country Link
US (1) US4089105A (OSRAM)
JP (2) JPS5364792A (OSRAM)
CA (1) CA1082895A (OSRAM)
DE (1) DE2745069A1 (OSRAM)
GB (1) GB1556114A (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164064A (en) * 1978-03-13 1979-08-14 General Dynamics Corporation Solder preform loading method and apparatus
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins
DE2834694C3 (de) * 1978-08-08 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur automatischen Bestückung von Leiterplatten mit elektrischen Bausteinen mit einseitig abstehenden Anschlußstiften
USRE32540E (en) * 1983-03-22 1987-11-10 Advanced Interconnections, Inc. Terminal positioning method and construction
US4610084A (en) * 1984-05-21 1986-09-09 At&T Technologies, Inc. Method and apparatus for inserting leads into holes in substrates
US4616410A (en) * 1985-05-17 1986-10-14 Augat Inc. High speed lead socket assembly machine
US5386626A (en) * 1993-09-10 1995-02-07 Cen Tronic Co., Ltd. Method for manufacturing a circuit board with a plurality of conductive terminal pins
US5701388A (en) * 1994-12-22 1997-12-23 Kohler Co. Combined heater and pump
JP6135598B2 (ja) * 2013-08-20 2017-05-31 株式会社村田製作所 チップの振込装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1790257B1 (de) * 1967-04-19 1971-12-02 Berg Electronics Inc Anschlussoese zum Einsetzen in Bohrungen von Schaltungsplatten
US3785035A (en) * 1968-07-01 1974-01-15 Amp Inc Insertion of liners into holes in printed circuit boards
US3653122A (en) * 1969-03-16 1972-04-04 Ncr Co Rod insertion method
US3667103A (en) * 1970-07-21 1972-06-06 Us Army Apparatus for inserting terminals in an apertured plate
US3736651A (en) * 1971-08-31 1973-06-05 Ibm Automatic pin insertion and bonding to a metallized pad on a substrate surface
US3722087A (en) * 1971-10-15 1973-03-27 Berg Electronics Inc Method and apparatus for mounting terminals on a circuit board
US3924325A (en) * 1974-07-02 1975-12-09 Molex Inc Method and apparatus for mounting terminal pins from a single side of a double sided terminal board

Also Published As

Publication number Publication date
DE2745069A1 (de) 1978-06-01
JPS6180592U (OSRAM) 1986-05-29
CA1082895A (en) 1980-08-05
US4089105A (en) 1978-05-16
GB1556114A (en) 1979-11-21
DE2745069C2 (OSRAM) 1988-08-04

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