JPS5354365U - - Google Patents

Info

Publication number
JPS5354365U
JPS5354365U JP13725076U JP13725076U JPS5354365U JP S5354365 U JPS5354365 U JP S5354365U JP 13725076 U JP13725076 U JP 13725076U JP 13725076 U JP13725076 U JP 13725076U JP S5354365 U JPS5354365 U JP S5354365U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13725076U
Other languages
Japanese (ja)
Other versions
JPS5727164Y2 (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976137250U priority Critical patent/JPS5727164Y2/ja
Publication of JPS5354365U publication Critical patent/JPS5354365U/ja
Application granted granted Critical
Publication of JPS5727164Y2 publication Critical patent/JPS5727164Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1976137250U 1976-10-12 1976-10-12 Expired JPS5727164Y2 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (sv) 1976-10-12 1976-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (sv) 1976-10-12 1976-10-12

Publications (2)

Publication Number Publication Date
JPS5354365U true JPS5354365U (sv) 1978-05-10
JPS5727164Y2 JPS5727164Y2 (sv) 1982-06-14

Family

ID=28746100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976137250U Expired JPS5727164Y2 (sv) 1976-10-12 1976-10-12

Country Status (1)

Country Link
JP (1) JPS5727164Y2 (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631156U (sv) * 1979-08-17 1981-03-26

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020215240A1 (en) 2019-04-24 2020-10-29 Henkel Ag & Co. Kgaa Vacuum impregnation device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115857U (sv) * 1974-07-23 1976-02-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115857U (sv) * 1974-07-23 1976-02-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631156U (sv) * 1979-08-17 1981-03-26
JPS5818520Y2 (ja) * 1979-08-17 1983-04-15 渋谷金属産業株式会社 スライド式窓枠の引手

Also Published As

Publication number Publication date
JPS5727164Y2 (sv) 1982-06-14

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