JPS5354365U - - Google Patents
Info
- Publication number
- JPS5354365U JPS5354365U JP1976137250U JP13725076U JPS5354365U JP S5354365 U JPS5354365 U JP S5354365U JP 1976137250 U JP1976137250 U JP 1976137250U JP 13725076 U JP13725076 U JP 13725076U JP S5354365 U JPS5354365 U JP S5354365U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976137250U JPS5727164Y2 (enFirst) | 1976-10-12 | 1976-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976137250U JPS5727164Y2 (enFirst) | 1976-10-12 | 1976-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5354365U true JPS5354365U (enFirst) | 1978-05-10 |
| JPS5727164Y2 JPS5727164Y2 (enFirst) | 1982-06-14 |
Family
ID=28746100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976137250U Expired JPS5727164Y2 (enFirst) | 1976-10-12 | 1976-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5727164Y2 (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631156U (enFirst) * | 1979-08-17 | 1981-03-26 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710370A (zh) | 2019-04-24 | 2021-11-26 | 汉高股份有限及两合公司 | 真空浸渍装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115857U (enFirst) * | 1974-07-23 | 1976-02-05 |
-
1976
- 1976-10-12 JP JP1976137250U patent/JPS5727164Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115857U (enFirst) * | 1974-07-23 | 1976-02-05 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631156U (enFirst) * | 1979-08-17 | 1981-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5727164Y2 (enFirst) | 1982-06-14 |