JPS5337542A - Constant current density bump plating method - Google Patents

Constant current density bump plating method

Info

Publication number
JPS5337542A
JPS5337542A JP11337976A JP11337976A JPS5337542A JP S5337542 A JPS5337542 A JP S5337542A JP 11337976 A JP11337976 A JP 11337976A JP 11337976 A JP11337976 A JP 11337976A JP S5337542 A JPS5337542 A JP S5337542A
Authority
JP
Japan
Prior art keywords
constant current
current density
plating method
bump plating
density bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11337976A
Other languages
Japanese (ja)
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11337976A priority Critical patent/JPS5337542A/en
Publication of JPS5337542A publication Critical patent/JPS5337542A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11337976A 1976-09-20 1976-09-20 Constant current density bump plating method Pending JPS5337542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11337976A JPS5337542A (en) 1976-09-20 1976-09-20 Constant current density bump plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11337976A JPS5337542A (en) 1976-09-20 1976-09-20 Constant current density bump plating method

Publications (1)

Publication Number Publication Date
JPS5337542A true JPS5337542A (en) 1978-04-06

Family

ID=14610790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11337976A Pending JPS5337542A (en) 1976-09-20 1976-09-20 Constant current density bump plating method

Country Status (1)

Country Link
JP (1) JPS5337542A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
US4906341A (en) * 1987-09-24 1990-03-06 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and apparatus therefor
JP2000080496A (en) * 1998-09-03 2000-03-21 Ebara Corp Filling plating method for base material having fine pore and/or fine groove
JP2005272874A (en) * 2004-03-23 2005-10-06 Sumitomo Bakelite Co Ltd Method for producing circuit board
JP2009102674A (en) * 2007-10-22 2009-05-14 Ebara Corp Plating method and plating apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4906341A (en) * 1987-09-24 1990-03-06 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and apparatus therefor
JP2000080496A (en) * 1998-09-03 2000-03-21 Ebara Corp Filling plating method for base material having fine pore and/or fine groove
JP2005272874A (en) * 2004-03-23 2005-10-06 Sumitomo Bakelite Co Ltd Method for producing circuit board
JP2009102674A (en) * 2007-10-22 2009-05-14 Ebara Corp Plating method and plating apparatus

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