JPS5332730Y2 - - Google Patents
Info
- Publication number
- JPS5332730Y2 JPS5332730Y2 JP9718674U JP9718674U JPS5332730Y2 JP S5332730 Y2 JPS5332730 Y2 JP S5332730Y2 JP 9718674 U JP9718674 U JP 9718674U JP 9718674 U JP9718674 U JP 9718674U JP S5332730 Y2 JPS5332730 Y2 JP S5332730Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9718674U JPS5332730Y2 (en:Method) | 1974-08-12 | 1974-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9718674U JPS5332730Y2 (en:Method) | 1974-08-12 | 1974-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5124520U JPS5124520U (en:Method) | 1976-02-23 |
| JPS5332730Y2 true JPS5332730Y2 (en:Method) | 1978-08-14 |
Family
ID=28296376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9718674U Expired JPS5332730Y2 (en:Method) | 1974-08-12 | 1974-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5332730Y2 (en:Method) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53117739A (en) * | 1977-03-23 | 1978-10-14 | Nippon Electric Co | Method of producing hyb ic |
| JPS5647978Y2 (en:Method) * | 1977-07-21 | 1981-11-10 | ||
| JPS5490667U (en:Method) * | 1977-12-12 | 1979-06-27 | ||
| JPS54157268A (en) * | 1978-06-02 | 1979-12-12 | Oki Electric Ind Co Ltd | Metal plate compound multilayer flexible board |
| JPS5835382B2 (ja) * | 1978-08-15 | 1983-08-02 | 松下電工株式会社 | 充電式電気器具 |
| JPS55138299A (en) * | 1979-04-13 | 1980-10-28 | Yazaki Corp | Method of fabricating laminated circuit board |
| JPS55148494A (en) * | 1979-05-07 | 1980-11-19 | Olympus Optical Co | Device for mounting on flexible printed board |
| FR2524247A1 (fr) * | 1982-03-23 | 1983-09-30 | Thomson Csf | Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel |
| JPS61248496A (ja) * | 1985-04-25 | 1986-11-05 | オ−ケ−プリント配線株式会社 | フレキシブル基板装置 |
| JPH0341488Y2 (en:Method) * | 1985-12-21 | 1991-08-30 | ||
| JPS6447073U (en:Method) * | 1987-09-17 | 1989-03-23 | ||
| JP5031456B2 (ja) * | 2007-06-25 | 2012-09-19 | 有限会社京趣苑 | 簡易着付用帯体 |
-
1974
- 1974-08-12 JP JP9718674U patent/JPS5332730Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5124520U (en:Method) | 1976-02-23 |