JPS5331713B2 - - Google Patents

Info

Publication number
JPS5331713B2
JPS5331713B2 JP6296274A JP6296274A JPS5331713B2 JP S5331713 B2 JPS5331713 B2 JP S5331713B2 JP 6296274 A JP6296274 A JP 6296274A JP 6296274 A JP6296274 A JP 6296274A JP S5331713 B2 JPS5331713 B2 JP S5331713B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6296274A
Other languages
Japanese (ja)
Other versions
JPS50156366A (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6296274A priority Critical patent/JPS5331713B2/ja
Publication of JPS50156366A publication Critical patent/JPS50156366A/ja
Publication of JPS5331713B2 publication Critical patent/JPS5331713B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP6296274A 1974-06-05 1974-06-05 Expired JPS5331713B2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6296274A JPS5331713B2 (ja�@�@) 1974-06-05 1974-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6296274A JPS5331713B2 (ja�@�@) 1974-06-05 1974-06-05

Publications (2)

Publication Number Publication Date
JPS50156366A JPS50156366A (ja�@�@) 1975-12-17
JPS5331713B2 true JPS5331713B2 (ja�@�@) 1978-09-04

Family

ID=13215445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6296274A Expired JPS5331713B2 (ja�@�@) 1974-06-05 1974-06-05

Country Status (1)

Country Link
JP (1) JPS5331713B2 (ja�@�@)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754279Y2 (ja�@�@) * 1978-01-31 1982-11-24
JPS5943537A (ja) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp ワイヤボンデイング装置
JPS61166033A (ja) * 1985-07-12 1986-07-26 Hitachi Ltd ペレツトボンデイング方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1075166A (en) * 1975-07-08 1980-04-08 Uniroyal Ltd. Sorption of weak organic acids from water by polyurethane

Also Published As

Publication number Publication date
JPS50156366A (ja�@�@) 1975-12-17

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