JPS533074B1 - - Google Patents
Info
- Publication number
- JPS533074B1 JPS533074B1 JP3514867A JP3514867A JPS533074B1 JP S533074 B1 JPS533074 B1 JP S533074B1 JP 3514867 A JP3514867 A JP 3514867A JP 3514867 A JP3514867 A JP 3514867A JP S533074 B1 JPS533074 B1 JP S533074B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3514867A JPS533074B1 (ko) | 1967-06-03 | 1967-06-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3514867A JPS533074B1 (ko) | 1967-06-03 | 1967-06-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS533074B1 true JPS533074B1 (ko) | 1978-02-02 |
Family
ID=12433804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3514867A Pending JPS533074B1 (ko) | 1967-06-03 | 1967-06-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS533074B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200111027A (ko) * | 2019-03-18 | 2020-09-28 | 한양대학교 산학협력단 | RoIP 선형 예측 부호화 및 비선형 양자화 융합 압축 송신 방법 |
-
1967
- 1967-06-03 JP JP3514867A patent/JPS533074B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200111027A (ko) * | 2019-03-18 | 2020-09-28 | 한양대학교 산학협력단 | RoIP 선형 예측 부호화 및 비선형 양자화 융합 압축 송신 방법 |