JPS5329667A - Composite semiconductor device - Google Patents

Composite semiconductor device

Info

Publication number
JPS5329667A
JPS5329667A JP10443776A JP10443776A JPS5329667A JP S5329667 A JPS5329667 A JP S5329667A JP 10443776 A JP10443776 A JP 10443776A JP 10443776 A JP10443776 A JP 10443776A JP S5329667 A JPS5329667 A JP S5329667A
Authority
JP
Japan
Prior art keywords
composite semiconductor
semiconductor device
housing
thermocouple
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10443776A
Other languages
Japanese (ja)
Inventor
Isamu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10443776A priority Critical patent/JPS5329667A/en
Publication of JPS5329667A publication Critical patent/JPS5329667A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: Easy detecting of whether the housing of a composite semiconductor during operation has reached the specified temperature or not is made possible without using any thermocouple by attaching a temperature indicating material on the outside lateral surface of the housing.
COPYRIGHT: (C)1978,JPO&Japio
JP10443776A 1976-08-31 1976-08-31 Composite semiconductor device Pending JPS5329667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10443776A JPS5329667A (en) 1976-08-31 1976-08-31 Composite semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10443776A JPS5329667A (en) 1976-08-31 1976-08-31 Composite semiconductor device

Publications (1)

Publication Number Publication Date
JPS5329667A true JPS5329667A (en) 1978-03-20

Family

ID=14380630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10443776A Pending JPS5329667A (en) 1976-08-31 1976-08-31 Composite semiconductor device

Country Status (1)

Country Link
JP (1) JPS5329667A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167561U (en) * 1980-05-15 1981-12-11
CN115038816A (en) * 2020-01-31 2022-09-09 日本电解株式会社 Metal foil, method for manufacturing metal foil, and method for processing electrodeposition roller used for metal foil

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167561U (en) * 1980-05-15 1981-12-11
CN115038816A (en) * 2020-01-31 2022-09-09 日本电解株式会社 Metal foil, method for manufacturing metal foil, and method for processing electrodeposition roller used for metal foil

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