JPS5327816B2 - - Google Patents

Info

Publication number
JPS5327816B2
JPS5327816B2 JP2474673A JP2474673A JPS5327816B2 JP S5327816 B2 JPS5327816 B2 JP S5327816B2 JP 2474673 A JP2474673 A JP 2474673A JP 2474673 A JP2474673 A JP 2474673A JP S5327816 B2 JPS5327816 B2 JP S5327816B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2474673A
Other languages
Japanese (ja)
Other versions
JPS48100618A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS48100618A publication Critical patent/JPS48100618A/ja
Publication of JPS5327816B2 publication Critical patent/JPS5327816B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP2474673A 1972-03-02 1973-03-01 Expired JPS5327816B2 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2209993A DE2209993C3 (de) 1972-03-02 1972-03-02 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
JPS48100618A JPS48100618A (zh) 1973-12-19
JPS5327816B2 true JPS5327816B2 (zh) 1978-08-10

Family

ID=5837659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2474673A Expired JPS5327816B2 (zh) 1972-03-02 1973-03-01

Country Status (6)

Country Link
JP (1) JPS5327816B2 (zh)
BE (1) BE795939A (zh)
CH (1) CH548111A (zh)
DE (1) DE2209993C3 (zh)
FR (1) FR2174237B1 (zh)
GB (1) GB1364832A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208655A (ja) * 1985-03-13 1986-09-17 Pioneer Electronic Corp 磁気記録再生装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2402606C2 (de) * 1974-01-21 1982-08-19 Brown, Boveri & Cie Ag, 6800 Mannheim Flüssigkeitskühleinrichtung für scheibenförmige Halbleiterelemente
JPS5623891Y2 (zh) * 1975-09-08 1981-06-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208655A (ja) * 1985-03-13 1986-09-17 Pioneer Electronic Corp 磁気記録再生装置

Also Published As

Publication number Publication date
CH548111A (de) 1974-04-11
BE795939A (fr) 1973-06-18
JPS48100618A (zh) 1973-12-19
DE2209993B2 (de) 1974-06-12
DE2209993C3 (de) 1975-01-30
FR2174237A1 (zh) 1973-10-12
GB1364832A (en) 1974-08-29
DE2209993A1 (de) 1973-09-13
FR2174237B1 (zh) 1977-08-12

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