JPS5324266A - Integrated circuit device - Google Patents
Integrated circuit deviceInfo
- Publication number
- JPS5324266A JPS5324266A JP9910776A JP9910776A JPS5324266A JP S5324266 A JPS5324266 A JP S5324266A JP 9910776 A JP9910776 A JP 9910776A JP 9910776 A JP9910776 A JP 9910776A JP S5324266 A JPS5324266 A JP S5324266A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- bending
- fixing
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent the external leader lines from bending, by fixing their ends with a frame.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51099107A JPS5918866B2 (en) | 1976-08-18 | 1976-08-18 | integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51099107A JPS5918866B2 (en) | 1976-08-18 | 1976-08-18 | integrated circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5324266A true JPS5324266A (en) | 1978-03-06 |
JPS5918866B2 JPS5918866B2 (en) | 1984-05-01 |
Family
ID=14238597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51099107A Expired JPS5918866B2 (en) | 1976-08-18 | 1976-08-18 | integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5918866B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6271253A (en) * | 1985-07-23 | 1987-04-01 | フエアチヤイルド セミコンダクタ コ−ポレ−シヨン | Semiconductor chip package structure, its test and facilitating method for mounting on substrate |
US5473199A (en) * | 1992-03-02 | 1995-12-05 | Fujitsu Limited | Semiconductor device having a body with a carrier ring connected thereto |
-
1976
- 1976-08-18 JP JP51099107A patent/JPS5918866B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6271253A (en) * | 1985-07-23 | 1987-04-01 | フエアチヤイルド セミコンダクタ コ−ポレ−シヨン | Semiconductor chip package structure, its test and facilitating method for mounting on substrate |
US5473199A (en) * | 1992-03-02 | 1995-12-05 | Fujitsu Limited | Semiconductor device having a body with a carrier ring connected thereto |
US5610080A (en) * | 1992-03-02 | 1997-03-11 | Fujitsu Ltd. | Method for producing semiconductor device having a body with a carrier ring connected thereto |
Also Published As
Publication number | Publication date |
---|---|
JPS5918866B2 (en) | 1984-05-01 |
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