JPS5320384B2 - - Google Patents
Info
- Publication number
- JPS5320384B2 JPS5320384B2 JP3356174A JP3356174A JPS5320384B2 JP S5320384 B2 JPS5320384 B2 JP S5320384B2 JP 3356174 A JP3356174 A JP 3356174A JP 3356174 A JP3356174 A JP 3356174A JP S5320384 B2 JPS5320384 B2 JP S5320384B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356174A JPS5320384B2 (en:Method) | 1974-03-27 | 1974-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356174A JPS5320384B2 (en:Method) | 1974-03-27 | 1974-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50128465A JPS50128465A (en:Method) | 1975-10-09 |
| JPS5320384B2 true JPS5320384B2 (en:Method) | 1978-06-26 |
Family
ID=12389948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3356174A Expired JPS5320384B2 (en:Method) | 1974-03-27 | 1974-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5320384B2 (en:Method) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5734767Y2 (en:Method) * | 1975-09-30 | 1982-07-31 | ||
| JPS58192688A (ja) * | 1982-04-30 | 1983-11-10 | Chiyouonpa Kogyo Kk | ワイヤボンデイング装置におけるワイヤル−プ整形方法 |
| JPS62274631A (ja) * | 1986-05-22 | 1987-11-28 | Fuji Electric Co Ltd | ワイヤボンデイング装置 |
-
1974
- 1974-03-27 JP JP3356174A patent/JPS5320384B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50128465A (en:Method) | 1975-10-09 |